JPS6073277U - hybrid integrated circuit board - Google Patents
hybrid integrated circuit boardInfo
- Publication number
- JPS6073277U JPS6073277U JP16467283U JP16467283U JPS6073277U JP S6073277 U JPS6073277 U JP S6073277U JP 16467283 U JP16467283 U JP 16467283U JP 16467283 U JP16467283 U JP 16467283U JP S6073277 U JPS6073277 U JP S6073277U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit board
- abstract
- connection pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は正常に半田付されｆ状態を示すミニ・モールド
部品の上面図、第２図は半田付不良による第１図同様図
、第３図は第１図における縦断面図、第４図は第２図に
おける縦断面図、第５図は本考案の一実施例に係る導体
接続用パッドを示す上面図、第６図は本考案によるミニ
・モールド部品取付状態を示す上面図である。
２・・・・・・導体接続用パッド、２ａ・・・・・・ス
リット、４・・・・・・リード線。Fig. 1 is a top view of the mini-mold part showing the normally soldered f state, Fig. 2 is a similar view to Fig. 1 due to poor soldering, Fig. 3 is a vertical cross-sectional view of Fig. 1, and Fig. 4 2 is a longitudinal sectional view in FIG. 2, FIG. 5 is a top view showing a conductor connection pad according to an embodiment of the present invention, and FIG. 6 is a top view showing a state in which the mini mold component according to the present invention is attached. 2...Conductor connection pad, 2a...Slit, 4...Lead wire.
Claims (1)
ド線長手方向のスリットを設けたことを特徴とする混成
集積回路基板。A hybrid integrated circuit board characterized in that a slit extending in the longitudinal direction of a lead wire is provided in the center of a conductor connection pad of the thick film printed hybrid integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16467283U JPS6073277U (en) | 1983-10-26 | 1983-10-26 | hybrid integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16467283U JPS6073277U (en) | 1983-10-26 | 1983-10-26 | hybrid integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6073277U true JPS6073277U (en) | 1985-05-23 |
Family
ID=30360970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16467283U Pending JPS6073277U (en) | 1983-10-26 | 1983-10-26 | hybrid integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6073277U (en) |
-
1983
- 1983-10-26 JP JP16467283U patent/JPS6073277U/en active Pending
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