JPS5878681U - printed wiring circuit - Google Patents

printed wiring circuit

Info

Publication number
JPS5878681U
JPS5878681U JP17319481U JP17319481U JPS5878681U JP S5878681 U JPS5878681 U JP S5878681U JP 17319481 U JP17319481 U JP 17319481U JP 17319481 U JP17319481 U JP 17319481U JP S5878681 U JPS5878681 U JP S5878681U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring circuit
soldered
leadless
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17319481U
Other languages
Japanese (ja)
Inventor
上野　良友
政憲 原本
修司 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP17319481U priority Critical patent/JPS5878681U/en
Publication of JPS5878681U publication Critical patent/JPS5878681U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来のチップ状電子部品のランドの形状を示
した平面図、第２図ａ、　　ｂはこの考案のプリント配
線回路に使用するチップ状電子部品のランドの形状図、
及び半田付けしたときの側面図、第３図ａ、　　ｂはこ
ρ考案の他の実施例を示すランドの形状図である。 図中、１０はチップ状電子部品、１１．１１は電極部、
１２．１２’はランドを示す。FIG. 1 is a plan view showing the shape of the land of a conventional chip-shaped electronic component, and FIGS.
FIGS. 3a and 3b are diagrams showing the shape of a land showing another embodiment of this invention. In the figure, 10 is a chip-shaped electronic component, 11.11 is an electrode part,
12.12' indicates a land.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードレス回路素子を半田付けするプリント配線回路に
おいて、前記リードレス回路素子を半田付けするランド
をほぼ方形状に形成すると共に、その中央部分が両側辺
部より幅狭となる形状としたことを特徴とするプリント
配線回路。A printed wiring circuit to which a leadless circuit element is soldered, characterized in that the land to which the leadless circuit element is soldered is formed into a substantially rectangular shape, and the center part thereof is narrower than both side parts. printed wiring circuit.
JP17319481U 1981-11-24 1981-11-24 printed wiring circuit Pending JPS5878681U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17319481U JPS5878681U (en) 1981-11-24 1981-11-24 printed wiring circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17319481U JPS5878681U (en) 1981-11-24 1981-11-24 printed wiring circuit

Publications (1)

Publication Number Publication Date
JPS5878681U true JPS5878681U (en) 1983-05-27

Family

ID=29965056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17319481U Pending JPS5878681U (en) 1981-11-24 1981-11-24 printed wiring circuit

Country Status (1)

Country Link
JP (1) JPS5878681U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59127263U (en) * 1983-02-17 1984-08-27 日本メクトロン株式会社 Land pattern of flexible printed board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59127263U (en) * 1983-02-17 1984-08-27 日本メクトロン株式会社 Land pattern of flexible printed board

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