JPS6094861U - printed circuit device - Google Patents
printed circuit deviceInfo
- Publication number
- JPS6094861U JPS6094861U JP18575283U JP18575283U JPS6094861U JP S6094861 U JPS6094861 U JP S6094861U JP 18575283 U JP18575283 U JP 18575283U JP 18575283 U JP18575283 U JP 18575283U JP S6094861 U JPS6094861 U JP S6094861U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit device
- substrate
- conductor
- chip carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のものの要部分解側面図、第２図はこの考
案の一実施例の要部分解側面図、第３図は第２図の■−
■線に沿う平面での断面図である。
１・・・・・・基板、２・・・・・・導体、２ａ・・・
・・・はんだ溜め、３・・・・・・リードレスチップキ
ャリア、４・・・・・・接続導体。なお、各図中、同一
符号は同−又は相当部分を示す。Fig. 1 is an exploded side view of the main part of the conventional one, Fig. 2 is an exploded side view of the main part of an embodiment of this invention, and Fig. 3 is the -
■It is a cross-sectional view on a plane along the line. 1...Substrate, 2...Conductor, 2a...
... Solder reservoir, 3 ... Leadless chip carrier, 4 ... Connection conductor. In each figure, the same reference numerals indicate the same or corresponding parts.
Claims (1)
リアに設けた接続導体の下面とをはんだ付けすることに
より、前記リードレスチップキャリアを前記基板に取付
けてなる印刷回路装置において、前記導体の上面に形成
され溝状の凹部でなるはんだ溜めを備えてなることを特
徴とする印刷回路装置。In the printed circuit device in which the leadless chip carrier is attached to the substrate by soldering the upper surface of the conductor disposed on the substrate and the lower surface of the connecting conductor provided on the leadless chip carrier, the conductor is connected to the substrate. 1. A printed circuit device comprising a solder reservoir formed on an upper surface and consisting of a groove-like recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18575283U JPS6094861U (en) | 1983-12-02 | 1983-12-02 | printed circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18575283U JPS6094861U (en) | 1983-12-02 | 1983-12-02 | printed circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6094861U true JPS6094861U (en) | 1985-06-28 |
Family
ID=30401409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18575283U Pending JPS6094861U (en) | 1983-12-02 | 1983-12-02 | printed circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6094861U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05218666A (en) * | 1992-02-06 | 1993-08-27 | Murata Mfg Co Ltd | Soldering structure for electronic component |
-
1983
- 1983-12-02 JP JP18575283U patent/JPS6094861U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05218666A (en) * | 1992-02-06 | 1993-08-27 | Murata Mfg Co Ltd | Soldering structure for electronic component |
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