JPS5822763U - Mounting device for chip-shaped parts - Google Patents
Mounting device for chip-shaped partsInfo
- Publication number
- JPS5822763U JPS5822763U JP11706881U JP11706881U JPS5822763U JP S5822763 U JPS5822763 U JP S5822763U JP 11706881 U JP11706881 U JP 11706881U JP 11706881 U JP11706881 U JP 11706881U JP S5822763 U JPS5822763 U JP S5822763U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- printed circuit
- mounting device
- shaped parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の取付装置を示す概要図、第2図はこの考
案の一実施例であるチップ状部品の取付装置を示す概要
図である。
図中、2はチップ状部品、2aは半田付は部、6はプリ
ント基板、6aは貫通孔、6bはパターン部、7は粘着
シート、7aは粘着面である。なお、図中、同一符号は
同一あるいは相当部分を示すものとする。FIG. 1 is a schematic diagram showing a conventional mounting device, and FIG. 2 is a schematic diagram showing a chip-shaped component mounting device which is an embodiment of this invention. In the figure, 2 is a chip-shaped component, 2a is a soldering part, 6 is a printed circuit board, 6a is a through hole, 6b is a pattern part, 7 is an adhesive sheet, and 7a is an adhesive surface. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
プ状部品が挿入される貫通孔と、この貫通孔に近接して
形成された接続用パターン部とを有するプリント基板、
このプリント基板における上記接続用パターン部の反対
面側に配置された粘着シートを備え、上記チップ状部品
を上記プリント基板の貫通孔を介して粘着シートに粘着
保持させ、プリント基板の接続用パターン部に半田付け
したことを特徴とするチップ状部品の取付装置。A printed circuit board having a chip-like component having solder portions formed at both ends, a through-hole into which the chip-like component is inserted, and a connection pattern portion formed close to the through-hole;
An adhesive sheet is provided on the opposite side of the connection pattern section of the printed circuit board, and the chip-like component is adhesively held on the adhesive sheet through the through hole of the printed circuit board, and the connection pattern section of the printed circuit board is provided with an adhesive sheet. A mounting device for chip-shaped parts, characterized in that the parts are soldered to the chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11706881U JPS5822763U (en) | 1981-08-05 | 1981-08-05 | Mounting device for chip-shaped parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11706881U JPS5822763U (en) | 1981-08-05 | 1981-08-05 | Mounting device for chip-shaped parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5822763U true JPS5822763U (en) | 1983-02-12 |
Family
ID=29911274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11706881U Pending JPS5822763U (en) | 1981-08-05 | 1981-08-05 | Mounting device for chip-shaped parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5822763U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6299261U (en) * | 1985-12-11 | 1987-06-24 |
-
1981
- 1981-08-05 JP JP11706881U patent/JPS5822763U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6299261U (en) * | 1985-12-11 | 1987-06-24 | ||
JPH0541715Y2 (en) * | 1985-12-11 | 1993-10-21 |
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