JPS59123364U - circuit device - Google Patents
circuit deviceInfo
- Publication number
- JPS59123364U JPS59123364U JP1615883U JP1615883U JPS59123364U JP S59123364 U JPS59123364 U JP S59123364U JP 1615883 U JP1615883 U JP 1615883U JP 1615883 U JP1615883 U JP 1615883U JP S59123364 U JPS59123364 U JP S59123364U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- circuit device
- chip
- conductor round
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はハンダ付けする前の本考案実施例回路装置の要
部断面図、第２図はハンダ付は後の同実施例要部断面図
、第３図は本考案に適用するプリント基板のパターン実
施例平面図である。
符号の説明、１・・・・・・プリント基板、２Ａ・・・
・・・導体ラウンド、４・・・・・・凹部、５・・・・
・・チップ状回路部品、７・・・・・・電極、８・・・
・・・ハンダ。Fig. 1 is a sectional view of the main parts of the circuit device according to the present invention before soldering, Fig. 2 is a sectional view of the main parts of the same embodiment after soldering, and Fig. 3 is a sectional view of the main parts of the circuit device according to the present invention. It is a top view of a pattern example. Explanation of symbols, 1...Printed circuit board, 2A...
...Conductor round, 4...Concavity, 5...
...Chip-shaped circuit component, 7...Electrode, 8...
...Solder.
Claims (1)
せる位−に凹部が設けられた導体ラウンドを具備したプ
リント基板とからなり、上記電極をして上記導体ラウン
ドに密着せざる状態にて上記電極と上記導体ラウンドが
ハンダ付けされている回路装置。It consists of a chip-shaped circuit component and a printed circuit board equipped with a conductor round having a concave portion at a position substantially opposite to the electrode of the chip-shaped circuit component, and the circuit board is arranged such that the electrode is not in close contact with the conductor round. A circuit device in which the electrode and the conductor round are soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1615883U JPS59123364U (en) | 1983-02-08 | 1983-02-08 | circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1615883U JPS59123364U (en) | 1983-02-08 | 1983-02-08 | circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59123364U true JPS59123364U (en) | 1984-08-20 |
Family
ID=30147459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1615883U Pending JPS59123364U (en) | 1983-02-08 | 1983-02-08 | circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59123364U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09232737A (en) * | 1996-02-28 | 1997-09-05 | Hitachi Aic Inc | Printed wiring board |
| JP2014165215A (en) * | 2013-02-21 | 2014-09-08 | Denso Corp | Electronic component |
| JP2022108915A (en) * | 2021-01-14 | 2022-07-27 | 住友電気工業株式会社 | Semiconductor device |
-
1983
- 1983-02-08 JP JP1615883U patent/JPS59123364U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09232737A (en) * | 1996-02-28 | 1997-09-05 | Hitachi Aic Inc | Printed wiring board |
| JP2014165215A (en) * | 2013-02-21 | 2014-09-08 | Denso Corp | Electronic component |
| JP2022108915A (en) * | 2021-01-14 | 2022-07-27 | 住友電気工業株式会社 | Semiconductor device |
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