JPS59121859U - Composite board device - Google Patents
Composite board deviceInfo
- Publication number
- JPS59121859U JPS59121859U JP1375883U JP1375883U JPS59121859U JP S59121859 U JPS59121859 U JP S59121859U JP 1375883 U JP1375883 U JP 1375883U JP 1375883 U JP1375883 U JP 1375883U JP S59121859 U JPS59121859 U JP S59121859U
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- board
- composite board
- board device
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims 2
- 239000002184 metal Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案実施例を示し、第１図は実施例分解斜視図
、第２図は実施例の要部概略図である。
符号の説明、１・・・・・・金属基板、２・・・・・・
絶縁性基板、９・・・・・・リード部、１０・・・・・
・ディスクリート部品。The drawings show an embodiment of the present invention; FIG. 1 is an exploded perspective view of the embodiment, and FIG. 2 is a schematic diagram of the main parts of the embodiment. Explanation of symbols, 1...Metal substrate, 2...
Insulating substrate, 9...Lead part, 10...
・Discrete parts.
Claims (1)
回路パターンへ接続されるべき少なくとも基板を厚み方
向に挿通すべくリード部を有するディスクリート部品を
上記回路パターン上へ直接ハンダ付けせずに、上記回路
パターンへ電気的に接続されて上記回路パターン形成側
で上記金属基板に対して起立せしめて固定した絶縁性基
板の回路パターン上へハンダ付けしてなることを特徴と
する複合基板装置。In order to insert at least the board in the thickness direction to be connected to the circuit pattern of a metal substrate on which a circuit pattern is formed via an insulating layer, the above-mentioned method is performed without directly soldering a discrete component having a lead portion onto the circuit pattern. 1. A composite board device, characterized in that the circuit pattern is soldered onto an insulating board that is electrically connected to the circuit pattern and fixed in an upright position relative to the metal board on the side where the circuit pattern is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1375883U JPS59121859U (en) | 1983-02-03 | 1983-02-03 | Composite board device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1375883U JPS59121859U (en) | 1983-02-03 | 1983-02-03 | Composite board device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59121859U true JPS59121859U (en) | 1984-08-16 |
Family
ID=30145140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1375883U Pending JPS59121859U (en) | 1983-02-03 | 1983-02-03 | Composite board device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59121859U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0377472U (en) * | 1989-11-30 | 1991-08-05 |
-
1983
- 1983-02-03 JP JP1375883U patent/JPS59121859U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0377472U (en) * | 1989-11-30 | 1991-08-05 |
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