JPS60109358U - Block board connection structure - Google Patents

Block board connection structure

Info

Publication number
JPS60109358U
JPS60109358U JP19913883U JP19913883U JPS60109358U JP S60109358 U JPS60109358 U JP S60109358U JP 19913883 U JP19913883 U JP 19913883U JP 19913883 U JP19913883 U JP 19913883U JP S60109358 U JPS60109358 U JP S60109358U
Authority
JP
Japan
Prior art keywords
block board
connection structure
board
board connection
block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19913883U
Other languages
Japanese (ja)
Inventor
伊地知　定嘉
門馬　神一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP19913883U priority Critical patent/JPS60109358U/en
Publication of JPS60109358U publication Critical patent/JPS60109358U/en
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

一第１図〜第３図は従来例を示し、第１図はブロック基
板の平面図、第２図は第１図に示したブロック基板をデ
ィップ半田するために接続ピンをプリント基板に差込ん
で立設した状態を示す斜視図、第３図は第２図に示すプ
リント基板の要部平面図である。第４図は他の従来例の
ブロック基板の平面図である。第５図及び第６図は本考
案の実施例を示し、第５図は円筒形をしたブロック基板
の斜視図、第６図は第５図のブロック基板をプリント基
板にリフロー半田した状態を示す斜視図である。、 １．６・・・ブロック基板、２・・・チップ部品、３゜
７・・・導体パターン、５・・・プリント基板。- Figures 1 to 3 show conventional examples, Figure 1 is a plan view of a block board, and Figure 2 is a connection pin inserted into a printed circuit board for dip soldering of the block board shown in Figure 1. FIG. 3 is a perspective view showing the printed circuit board in an upright state; FIG. 3 is a plan view of the main parts of the printed circuit board shown in FIG. 2; FIG. 4 is a plan view of another conventional block substrate. Figures 5 and 6 show an embodiment of the present invention, Figure 5 is a perspective view of a cylindrical block board, and Figure 6 shows the block board of Figure 5 reflow soldered to a printed circuit board. FIG. , 1.6...Block board, 2...Chip component, 3゜7...Conductor pattern, 5...Printed board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フレキシブル絶縁薄板を円筒状に折曲げ形成してなるブ
ロック基板と、該ブロック基板を取付け゛　　　るプリ
ント基板とより成り、前記プリント基板上に前記円筒状
のブロック基板を半田接続したことを特徴とするブロッ
ク基板の接続構造。It is characterized by comprising a block board formed by bending a flexible thin insulating plate into a cylindrical shape, and a printed circuit board to which the block board is attached, and the cylindrical block board is connected to the printed board by soldering. Block board connection structure.
JP19913883U 1983-12-28 1983-12-28 Block board connection structure Pending JPS60109358U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19913883U JPS60109358U (en) 1983-12-28 1983-12-28 Block board connection structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19913883U JPS60109358U (en) 1983-12-28 1983-12-28 Block board connection structure

Publications (1)

Publication Number Publication Date
JPS60109358U true JPS60109358U (en) 1985-07-25

Family

ID=30758777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19913883U Pending JPS60109358U (en) 1983-12-28 1983-12-28 Block board connection structure

Country Status (1)

Country Link
JP (1) JPS60109358U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015094259A1 (en) 2013-12-19 2015-06-25 Intel Corporation Flexibly-wrapped integrated circuit die

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015094259A1 (en) 2013-12-19 2015-06-25 Intel Corporation Flexibly-wrapped integrated circuit die
CN106030781A (en) * 2013-12-19 2016-10-12 英特尔公司 Flexibly-wrapped integrated circuit die
JP2016537814A (en) * 2013-12-19 2016-12-01 インテル・コーポレーション Integrated circuit die device, integrated circuit die device encased with flexibility, and method of mounting an integrated circuit die encased with flexibility on a substrate
EP3084824A4 (en) * 2013-12-19 2017-08-16 Intel Corporation Flexibly-wrapped integrated circuit die

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