JPS60118266U - Printed board - Google Patents

Printed board

Info

Publication number
JPS60118266U
JPS60118266U JP458584U JP458584U JPS60118266U JP S60118266 U JPS60118266 U JP S60118266U JP 458584 U JP458584 U JP 458584U JP 458584 U JP458584 U JP 458584U JP S60118266 U JPS60118266 U JP S60118266U
Authority
JP
Japan
Prior art keywords
printed board
width
chip component
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP458584U
Other languages
Japanese (ja)
Inventor
新開　忠幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP458584U priority Critical patent/JPS60118266U/en
Publication of JPS60118266U publication Critical patent/JPS60118266U/en
Pending legal-status Critical Current

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図Ａ、　Ｂないし、第３図は従来例に係り、第１図
Ａ、　Ｂはプリント基板の要部平面図および要部拡大図
、第２図は、チップ部品を載置した要部斜視図、第３図
は、第２図において、半田付けした要部斜視図、第４図
、第５図は、本考案の実施例に係り、いずれも要部拡大
図である。 １・・・・・・チップ部品、１ａ・・・・・・電極、２
・・・・・・回路パターン、２ａ・・・・・・半田ラン
ド、３・・・・・・半田、４・・・・・・絶縁基板。Figures 1A, B to 3 relate to the conventional example, Figures 1A and B are a plan view and an enlarged view of the main parts of the printed circuit board, and Figure 2 is the main part on which chip components are mounted. The perspective view and FIG. 3 are perspective views of the main parts soldered in FIG. 2, and FIGS. 4 and 5 are enlarged views of the main parts of the embodiment of the present invention. 1... Chip component, 1a... Electrode, 2
...Circuit pattern, 2a...Solder land, 3...Solder, 4...Insulating board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板上に所定の回路パターンが導電材によって形成
されているプリント基板において、前記回路パターンの
チップ部品を固着するための半田ランドの巾がチップ部
品の巾に等しいか、もしくは狭いことを特徴とするプリ
ント基板。A printed circuit board having a predetermined circuit pattern formed of a conductive material on an insulating substrate, characterized in that the width of a solder land for fixing a chip component of the circuit pattern is equal to or narrower than the width of the chip component. printed circuit board.
JP458584U 1984-01-19 1984-01-19 Printed board Pending JPS60118266U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP458584U JPS60118266U (en) 1984-01-19 1984-01-19 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP458584U JPS60118266U (en) 1984-01-19 1984-01-19 Printed board

Publications (1)

Publication Number Publication Date
JPS60118266U true JPS60118266U (en) 1985-08-09

Family

ID=30480301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP458584U Pending JPS60118266U (en) 1984-01-19 1984-01-19 Printed board

Country Status (1)

Country Link
JP (1) JPS60118266U (en)

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