JPS6066068U - Chip parts mounting device - Google Patents

Chip parts mounting device

Info

Publication number
JPS6066068U
JPS6066068U JP15773183U JP15773183U JPS6066068U JP S6066068 U JPS6066068 U JP S6066068U JP 15773183 U JP15773183 U JP 15773183U JP 15773183 U JP15773183 U JP 15773183U JP S6066068 U JPS6066068 U JP S6066068U
Authority
JP
Japan
Prior art keywords
mounting device
chip component
chip parts
parts mounting
land portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15773183U
Other languages
Japanese (ja)
Inventor
木村　恵英
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP15773183U priority Critical patent/JPS6066068U/en
Publication of JPS6066068U publication Critical patent/JPS6066068U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のチップ部品の取付装置を示す図で、イは
半田付着前の状態を示す斜視図、口は半田付着後の断面
図、ハは半田を多く使用した場合の断面図、第２図は本
考案に係るチップ部品の取付装置を示す図で、イは半田
付着前の状態を示す斜視図、口は半田付着後の断面図で
ある。 ７・・・・・・プリント基板、８・・・・・・導電パタ
ーン、１０・・・・・・チップ部品、１１・・・・・・
電極、１２・・・・・・ランド部、１３・・・・・・端
部、１５・・・・・・半田。Figure 1 is a diagram showing a conventional chip component mounting device, where A is a perspective view showing the state before solder is attached, the opening is a cross-sectional view after solder is attached, C is a cross-sectional view when a large amount of solder is used, and FIG. 2 is a diagram showing a chip component mounting device according to the present invention, in which A is a perspective view showing the state before solder is attached, and FIG. 2 is a sectional view after solder is attached. 7... Printed circuit board, 8... Conductive pattern, 10... Chip parts, 11...
Electrode, 12... Land portion, 13... End portion, 15... Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チップ部品の電極をプリント基板の導電パターンのラン
ド部に半田付けするようにしたチップ部品の取付装置に
於いて、前記ランド部の形状を、チップ部品側の端部に
近くなる程漸次幅広となるようにしたことを特徴とする
チップ部品の取付装置。In a chip component mounting device in which electrodes of a chip component are soldered to a land portion of a conductive pattern on a printed circuit board, the shape of the land portion becomes gradually wider as it approaches the end of the chip component side. A chip component mounting device characterized by:
JP15773183U 1983-10-12 1983-10-12 Chip parts mounting device Pending JPS6066068U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15773183U JPS6066068U (en) 1983-10-12 1983-10-12 Chip parts mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15773183U JPS6066068U (en) 1983-10-12 1983-10-12 Chip parts mounting device

Publications (1)

Publication Number Publication Date
JPS6066068U true JPS6066068U (en) 1985-05-10

Family

ID=30347671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15773183U Pending JPS6066068U (en) 1983-10-12 1983-10-12 Chip parts mounting device

Country Status (1)

Country Link
JP (1) JPS6066068U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008227183A (en) * 2007-03-13 2008-09-25 Fujitsu Ltd Printed board unit and printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008227183A (en) * 2007-03-13 2008-09-25 Fujitsu Ltd Printed board unit and printed circuit board

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