JPS6042761U - printed circuit board equipment - Google Patents

printed circuit board equipment

Info

Publication number
JPS6042761U
JPS6042761U JP13480383U JP13480383U JPS6042761U JP S6042761 U JPS6042761 U JP S6042761U JP 13480383 U JP13480383 U JP 13480383U JP 13480383 U JP13480383 U JP 13480383U JP S6042761 U JPS6042761 U JP S6042761U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
land
board equipment
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13480383U
Other languages
Japanese (ja)
Inventor
牛島　誠一
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP13480383U priority Critical patent/JPS6042761U/en
Publication of JPS6042761U publication Critical patent/JPS6042761U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来例の部品挿入状態の断面図、第２図は第１
図をプリント基板のはんだ付は側より見た平面図、第３
図はプリント基板に装着される機構部品の端子部の様子
を示す側面図、第４図〜第６図は従来例においてリード
穴のクリアランスが理論値以上である場合のはんだ付状
態を示す断面図、第７図は本考案の一実施例におけるラ
ンドの形状を示す平面図、第８図ａ、　ｂはそのはんだ
付の状態を説明するための断面図である。 １・・・・・・プリント基板、１ａ・・・・・・穴、２
・・・・・・電子部品、２ａ・・・・・・リード、１０
・・・・・・クリアランス、１４・・・・・・ランド、
１５・・・・・・補助ランド、１６〜１８・・・・・・
はんだ。Figure 1 is a cross-sectional view of the conventional example when parts are inserted, and Figure 2 is a cross-sectional view of the conventional example.
The figure below shows the soldering of the printed circuit board, a plan view from the side, and the third
The figure is a side view showing the state of the terminal section of a mechanical component mounted on a printed circuit board, and Figures 4 to 6 are cross-sectional views showing the soldering state when the lead hole clearance is greater than the theoretical value in the conventional example. 7 is a plan view showing the shape of a land in an embodiment of the present invention, and FIGS. 8a and 8b are sectional views for explaining the soldering state thereof. 1...Printed circuit board, 1a...hole, 2
...Electronic component, 2a...Lead, 10
...Clearance, 14...Land,
15... Auxiliary land, 16-18...
Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板のリード挿入用の穴の周辺に、被はんだ付
部品のリードと上記穴の間のクリアランスと同一幅のラ
ンドを設け、上記ランドの外側に上記ランドの面積の約
１７２の面積を有する補助ランドを設けたことを特徴と
するプリント基板装置。A land having the same width as the clearance between the lead of the component to be soldered and the hole is provided around the lead insertion hole of the printed circuit board, and an auxiliary land having an area approximately 172 times the area of the land is provided outside the land. A printed circuit board device characterized by having a land.
JP13480383U 1983-08-31 1983-08-31 printed circuit board equipment Pending JPS6042761U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13480383U JPS6042761U (en) 1983-08-31 1983-08-31 printed circuit board equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13480383U JPS6042761U (en) 1983-08-31 1983-08-31 printed circuit board equipment

Publications (1)

Publication Number Publication Date
JPS6042761U true JPS6042761U (en) 1985-03-26

Family

ID=30303635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13480383U Pending JPS6042761U (en) 1983-08-31 1983-08-31 printed circuit board equipment

Country Status (1)

Country Link
JP (1) JPS6042761U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007094067A1 (en) * 2006-02-16 2007-08-23 Matsushita Electric Industrial Co., Ltd. Substrate structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5741113U (en) * 1980-08-20 1982-03-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5741113U (en) * 1980-08-20 1982-03-05

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007094067A1 (en) * 2006-02-16 2007-08-23 Matsushita Electric Industrial Co., Ltd. Substrate structure

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