JPS58162665U - Mounting structure of electronic components - Google Patents
Mounting structure of electronic componentsInfo
- Publication number
- JPS58162665U JPS58162665U JP6036782U JP6036782U JPS58162665U JP S58162665 U JPS58162665 U JP S58162665U JP 6036782 U JP6036782 U JP 6036782U JP 6036782 U JP6036782 U JP 6036782U JP S58162665 U JPS58162665 U JP S58162665U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- mounting structure
- chip component
- fitting hole
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例を示す斜視図、第2図乃至第5図は本考
案の一実施例を示すもので、第2図はチップ部品挿着前
の斜視図、第3図はチップ部品挿着後の平面図、第4図
は主要部の縦断面図、第5図は第3図のA矢視図である
。
1・・・・・・プリント基板、3・・・・・・チップ部
品、11a、llb・・・・・・嵌通孔、13・・・・
・・半田、14・・・・・・接着テープ。FIG. 1 is a perspective view showing a conventional example, FIGS. 2 to 5 show an embodiment of the present invention, FIG. 2 is a perspective view before inserting a chip component, and FIG. A plan view after installation, FIG. 4 is a longitudinal sectional view of the main part, and FIG. 5 is a view taken in the direction of arrow A in FIG. 3. 1...Printed circuit board, 3...chip component, 11a, llb...fitting hole, 13...
...Solder, 14...Adhesive tape.
Claims (1)
基板に設けられたパターンの近傍に嵌通孔を穿つととも
に該嵌通孔に、前記チップ部品を挿入した後に該チップ
部品の一端を、接着テープ、半田等によって固定したの
ちに他端をディッピング等によって半田付するように構
成した電子部品の取付は構造。In a device for fixing a chip component to a printed circuit board, a fitting hole is bored in the vicinity of a pattern provided on the substrate, and after the chip component is inserted into the fitting hole, one end of the chip component is fixed with an adhesive tape, The installation of electronic components is structured so that they are fixed with solder, etc., and then the other end is soldered by dipping, etc.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6036782U JPS58162665U (en) | 1982-04-24 | 1982-04-24 | Mounting structure of electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6036782U JPS58162665U (en) | 1982-04-24 | 1982-04-24 | Mounting structure of electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58162665U true JPS58162665U (en) | 1983-10-29 |
Family
ID=30070618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6036782U Pending JPS58162665U (en) | 1982-04-24 | 1982-04-24 | Mounting structure of electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58162665U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60236282A (en) * | 1984-05-09 | 1985-11-25 | ロ−ム株式会社 | Electronic circuit board |
-
1982
- 1982-04-24 JP JP6036782U patent/JPS58162665U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60236282A (en) * | 1984-05-09 | 1985-11-25 | ロ−ム株式会社 | Electronic circuit board |
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