JPS5931263U - Mounting structure of electronic components - Google Patents
Mounting structure of electronic componentsInfo
- Publication number
- JPS5931263U JPS5931263U JP12628482U JP12628482U JPS5931263U JP S5931263 U JPS5931263 U JP S5931263U JP 12628482 U JP12628482 U JP 12628482U JP 12628482 U JP12628482 U JP 12628482U JP S5931263 U JPS5931263 U JP S5931263U
- Authority
- JP
- Japan
- Prior art keywords
- mounting structure
- circuit board
- printed circuit
- hole
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図、第2図は従来の電子部品の取付構造を示す概要
図、第3図はこの考案の一実施例である電子部品の取付
構造を示す概要図である。
図中、1はプリント基板、1aはリード線挿入用穴、1
bは貫通穴、2は電子部品、3は接着剤である。なお、
図中、同一符号は同一あるいは相当する部分を示すもの
とする。1 and 2 are schematic diagrams showing a conventional electronic component mounting structure, and FIG. 3 is a schematic diagram showing an electronic component mounting structure according to an embodiment of the invention. In the figure, 1 is a printed circuit board, 1a is a hole for inserting a lead wire, 1
b is a through hole, 2 is an electronic component, and 3 is an adhesive. In addition,
In the drawings, the same reference numerals indicate the same or corresponding parts.
Claims (1)
穴とを有するプリント基板、このプリント基板のリード
線挿入用穴にリード線が挿入され、半田付は固定された
電子部品を備え、上記プリント基板の貫通穴を通して接
着剤を注入し、上記プリント基板と電子部品とを接着し
たことを特徴とする電子部品の取付構造。A printed circuit board having a lead wire insertion hole and a through hole provided adjacent to the hole, a lead wire inserted into the lead wire insertion hole of the printed circuit board, and an electronic component fixed by soldering. A mounting structure for an electronic component, characterized in that the printed circuit board and the electronic component are bonded by injecting an adhesive through the through hole of the printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12628482U JPS5931263U (en) | 1982-08-19 | 1982-08-19 | Mounting structure of electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12628482U JPS5931263U (en) | 1982-08-19 | 1982-08-19 | Mounting structure of electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5931263U true JPS5931263U (en) | 1984-02-27 |
Family
ID=30287207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12628482U Pending JPS5931263U (en) | 1982-08-19 | 1982-08-19 | Mounting structure of electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5931263U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020096111A (en) * | 2018-12-14 | 2020-06-18 | 株式会社明電舎 | Capacitor module for pulse power supply |
-
1982
- 1982-08-19 JP JP12628482U patent/JPS5931263U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020096111A (en) * | 2018-12-14 | 2020-06-18 | 株式会社明電舎 | Capacitor module for pulse power supply |
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