JPS60960U - Mounting structure for electronic components on printed wiring boards - Google Patents

Mounting structure for electronic components on printed wiring boards

Info

Publication number
JPS60960U
JPS60960U JP8972683U JP8972683U JPS60960U JP S60960 U JPS60960 U JP S60960U JP 8972683 U JP8972683 U JP 8972683U JP 8972683 U JP8972683 U JP 8972683U JP S60960 U JPS60960 U JP S60960U
Authority
JP
Japan
Prior art keywords
printed wiring
electronic components
mounting structure
wiring boards
mounting hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8972683U
Other languages
Japanese (ja)
Inventor
堀井　治雄
Original Assignee
富士通テン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通テン株式会社 filed Critical 富士通テン株式会社
Priority to JP8972683U priority Critical patent/JPS60960U/en
Publication of JPS60960U publication Critical patent/JPS60960U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例の平面図、第２図は第１図の
切断面線■−■から見た断面図である。 １・・・・・・印刷基板、２・・・・・・電子部品、３
・・・・・・取付孔、４・・・・・・銅箔、５・・・・
・・ハンダ、６・・・・・・周壁。FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along the section line 1--2 in FIG. 1...Printed circuit board, 2...Electronic components, 3
...Mounting hole, 4...Copper foil, 5...
...Solder, 6...Peripheral wall.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷基板に電子部品の一部が挿通する取付孔を形成し、
この取付孔の周辺の複数箇所に銅箔が印刷配線されてお
り、この銅箔には取付孔の半径方向内方に突出するよう
にしてハンダが固定されており、取付孔に挿通された電
子部品の周壁に前記ハンダが接触して印刷基板に電子部
品が固定されることを特徴とする電子部品の印刷配線基
板への取付構造。A mounting hole is formed on the printed circuit board through which a part of the electronic component is inserted.
Copper foil is printed and wired at multiple locations around this mounting hole, and solder is fixed to this copper foil so as to protrude inward in the radial direction of the mounting hole. 1. A structure for mounting an electronic component to a printed wiring board, characterized in that the electronic component is fixed to the printed circuit board by the solder coming into contact with a peripheral wall of the component.
JP8972683U 1983-06-10 1983-06-10 Mounting structure for electronic components on printed wiring boards Pending JPS60960U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8972683U JPS60960U (en) 1983-06-10 1983-06-10 Mounting structure for electronic components on printed wiring boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8972683U JPS60960U (en) 1983-06-10 1983-06-10 Mounting structure for electronic components on printed wiring boards

Publications (1)

Publication Number Publication Date
JPS60960U true JPS60960U (en) 1985-01-07

Family

ID=30219616

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8972683U Pending JPS60960U (en) 1983-06-10 1983-06-10 Mounting structure for electronic components on printed wiring boards

Country Status (1)

Country Link
JP (1) JPS60960U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139594U (en) * 1986-02-27 1987-09-03

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54109174A (en) * 1978-02-15 1979-08-27 Gen Corp Mounting construction of leadless component
JPS5543879A (en) * 1978-09-22 1980-03-27 Mitsubishi Electric Corp Hybrid integrated circuit device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54109174A (en) * 1978-02-15 1979-08-27 Gen Corp Mounting construction of leadless component
JPS5543879A (en) * 1978-09-22 1980-03-27 Mitsubishi Electric Corp Hybrid integrated circuit device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139594U (en) * 1986-02-27 1987-09-03
JPH0429679Y2 (en) * 1986-02-27 1992-07-17

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