JPS6096859U - Printed board - Google Patents

Printed board

Info

Publication number
JPS6096859U
JPS6096859U JP18939483U JP18939483U JPS6096859U JP S6096859 U JPS6096859 U JP S6096859U JP 18939483 U JP18939483 U JP 18939483U JP 18939483 U JP18939483 U JP 18939483U JP S6096859 U JPS6096859 U JP S6096859U
Authority
JP
Japan
Prior art keywords
printed board
copper foil
adjacent
printed circuit
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18939483U
Other languages
Japanese (ja)
Inventor
熊本 公美
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP18939483U priority Critical patent/JPS6096859U/en
Publication of JPS6096859U publication Critical patent/JPS6096859U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図乃至第3図は従来のプリント基板を示す平面図、
第4図は本考案のプリント基板の一実施例を示す平面図
である。 5・・・透孔、6・・・銅箔、7・・・スリット。
1 to 3 are plan views showing conventional printed circuit boards,
FIG. 4 is a plan view showing an embodiment of the printed circuit board of the present invention. 5...Through hole, 6...Copper foil, 7...Slit.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板に穿孔した少なくとも2個近接する部品取付用の透
孔と、この透孔の周囲にスリットを有する半田付着用の
銅箔とを形成し、少なくとも一方のスリットを他方の銅
箔との近接部分に設けたことを特徴とするプリント基板
At least two adjacent through-holes for mounting components are formed in the board, and a copper foil for solder attachment having a slit around the through-hole is formed, and at least one of the slits is connected to a portion adjacent to the other copper foil. A printed circuit board characterized by being provided with.
JP18939483U 1983-12-06 1983-12-06 Printed board Pending JPS6096859U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18939483U JPS6096859U (en) 1983-12-06 1983-12-06 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18939483U JPS6096859U (en) 1983-12-06 1983-12-06 Printed board

Publications (1)

Publication Number Publication Date
JPS6096859U true JPS6096859U (en) 1985-07-02

Family

ID=30408345

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18939483U Pending JPS6096859U (en) 1983-12-06 1983-12-06 Printed board

Country Status (1)

Country Link
JP (1) JPS6096859U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5550684A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5550684A (en) * 1978-10-06 1980-04-12 Hitachi Ltd Printed circuit board

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