JPS5977256U - Printed board - Google Patents

Printed board

Info

Publication number
JPS5977256U
JPS5977256U JP17308282U JP17308282U JPS5977256U JP S5977256 U JPS5977256 U JP S5977256U JP 17308282 U JP17308282 U JP 17308282U JP 17308282 U JP17308282 U JP 17308282U JP S5977256 U JPS5977256 U JP S5977256U
Authority
JP
Japan
Prior art keywords
printed board
solder
abstract
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17308282U
Other languages
Japanese (ja)
Inventor
卓夫 黒川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP17308282U priority Critical patent/JPS5977256U/en
Publication of JPS5977256U publication Critical patent/JPS5977256U/en
Pending legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a、  bは従来のプリント基板の正面図と断面
図、第2図a、  bは本考案のプリント基板の一実施
例を示す正面図と断面図である。 1・・・部品挿入孔、3・・・配線パターン、4・・・
半田、6・・・半田吸着パターン。
1A and 1B are a front view and a sectional view of a conventional printed circuit board, and FIGS. 2A and 2B are a front view and a sectional view of an embodiment of the printed circuit board of the present invention. 1...Component insertion hole, 3...Wiring pattern, 4...
Solder, 6...Solder adsorption pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 部品挿入孔を有する配線パターンの半田流に対する上手
近傍に半田吸着パターンを形成してなるプリント基板。
A printed circuit board in which a solder adsorption pattern is formed near the upper side of a wiring pattern having a component insertion hole relative to the solder flow.
JP17308282U 1982-11-15 1982-11-15 Printed board Pending JPS5977256U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17308282U JPS5977256U (en) 1982-11-15 1982-11-15 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17308282U JPS5977256U (en) 1982-11-15 1982-11-15 Printed board

Publications (1)

Publication Number Publication Date
JPS5977256U true JPS5977256U (en) 1984-05-25

Family

ID=30377133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17308282U Pending JPS5977256U (en) 1982-11-15 1982-11-15 Printed board

Country Status (1)

Country Link
JP (1) JPS5977256U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04130472U (en) * 1991-05-21 1992-11-30 松下電器産業株式会社 printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04130472U (en) * 1991-05-21 1992-11-30 松下電器産業株式会社 printed wiring board

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