JPS60121674U - Printed board - Google Patents

Printed board

Info

Publication number
JPS60121674U
JPS60121674U JP957284U JP957284U JPS60121674U JP S60121674 U JPS60121674 U JP S60121674U JP 957284 U JP957284 U JP 957284U JP 957284 U JP957284 U JP 957284U JP S60121674 U JPS60121674 U JP S60121674U
Authority
JP
Japan
Prior art keywords
printed board
circuit board
printed circuit
hole
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP957284U
Other languages
Japanese (ja)
Other versions
JPH0219982Y2 (en
Inventor
秀樹 久保田
桑原　満夫
工藤　勝次
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Meidensha Corp
Original Assignee
Meidensha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Meidensha Corp filed Critical Meidensha Corp
Priority to JP957284U priority Critical patent/JPS60121674U/en
Publication of JPS60121674U publication Critical patent/JPS60121674U/en
Application granted granted Critical
Publication of JPH0219982Y2 publication Critical patent/JPH0219982Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は多層印刷プリント基板のスルーホール部分を示
す断面斜視図、第２図と第３図は従来例を示す平面説明
図と導体斜視図、第４図Ａ、　Ｂ。 Ｃは本考案−に係るプリント基板のスルーホール部分を
示す平面説明図である。 ２・・・スルーホール、４・・・回路パターン、８五接
続パターン。FIG. 1 is a cross-sectional perspective view showing a through-hole portion of a multilayer printed circuit board, FIGS. 2 and 3 are a plan view and a conductor perspective view showing a conventional example, and FIGS. 4A and 4B. C is an explanatory plan view showing a through-hole portion of a printed circuit board according to the present invention. 2...Through hole, 4...Circuit pattern, 85 connection pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] スルーホールを部品取付孔とした多層印刷プリント基板
において、スルーホール２を取り巻く回路パターン４と
スルーホール孔壁２ａとを円周方向に長い線状の接続パ
ターン８で接続したことを特徴−とするプリント基板ｄA multilayer printed circuit board with through holes as component mounting holes, characterized in that the circuit pattern 4 surrounding the through hole 2 and the through hole wall 2a are connected by a long linear connection pattern 8 in the circumferential direction. printed circuit board d
JP957284U 1984-01-26 1984-01-26 Printed board Granted JPS60121674U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP957284U JPS60121674U (en) 1984-01-26 1984-01-26 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP957284U JPS60121674U (en) 1984-01-26 1984-01-26 Printed board

Publications (2)

Publication Number Publication Date
JPS60121674U true JPS60121674U (en) 1985-08-16
JPH0219982Y2 JPH0219982Y2 (en) 1990-05-31

Family

ID=30489918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP957284U Granted JPS60121674U (en) 1984-01-26 1984-01-26 Printed board

Country Status (1)

Country Link
JP (1) JPS60121674U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136596A (en) * 1986-11-27 1988-06-08 イビデン株式会社 Multilayer printed interconnection board
JPS64795A (en) * 1987-01-20 1989-01-05 Ibiden Co Ltd Multilayer printed-interconnection board
JP2007250697A (en) * 2006-03-14 2007-09-27 Nec Corp Wiring board with thermal land and electronic equipment provided therewith
JP5369685B2 (en) * 2006-08-02 2013-12-18 日本電気株式会社 Printed circuit board and electronic device
JP2017054882A (en) * 2015-09-08 2017-03-16 アスモ株式会社 Printed Wiring Board
WO2025206365A1 (en) * 2024-03-29 2025-10-02 ニデック株式会社 Circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136596A (en) * 1986-11-27 1988-06-08 イビデン株式会社 Multilayer printed interconnection board
JPS64795A (en) * 1987-01-20 1989-01-05 Ibiden Co Ltd Multilayer printed-interconnection board
JP2007250697A (en) * 2006-03-14 2007-09-27 Nec Corp Wiring board with thermal land and electronic equipment provided therewith
JP5369685B2 (en) * 2006-08-02 2013-12-18 日本電気株式会社 Printed circuit board and electronic device
JP2017054882A (en) * 2015-09-08 2017-03-16 アスモ株式会社 Printed Wiring Board
WO2025206365A1 (en) * 2024-03-29 2025-10-02 ニデック株式会社 Circuit board

Also Published As

Publication number Publication date
JPH0219982Y2 (en) 1990-05-31

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