JPS59177973U - Inner layer circuit board for multilayer printed wiring board - Google Patents

Inner layer circuit board for multilayer printed wiring board

Info

Publication number
JPS59177973U
JPS59177973U JP7282483U JP7282483U JPS59177973U JP S59177973 U JPS59177973 U JP S59177973U JP 7282483 U JP7282483 U JP 7282483U JP 7282483 U JP7282483 U JP 7282483U JP S59177973 U JPS59177973 U JP S59177973U
Authority
JP
Japan
Prior art keywords
inner layer
circuit board
layer circuit
printed wiring
multilayer printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7282483U
Other languages
Japanese (ja)
Inventor
吉沢　哲也
上山　宏治
邦雄 川口
Original Assignee
日立化成工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成工業株式会社 filed Critical 日立化成工業株式会社
Priority to JP7282483U priority Critical patent/JPS59177973U/en
Publication of JPS59177973U publication Critical patent/JPS59177973U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は内層回路板の平面図、第２図は多層印刷配線板
の断面図、第３図は内層回路板の拡大平面図、第４図は
本考案の内層回路板の拡大平面図、第５図は多層印刷配
線板の断面図である。 符号の説明、１・・・金属箔、２・・・クリアランス部
、６・・・パリ、７・・・金属層、９・・・内層回路板
、８・・・パリ。FIG. 1 is a plan view of the inner layer circuit board, FIG. 2 is a sectional view of the multilayer printed wiring board, FIG. 3 is an enlarged plan view of the inner layer circuit board, and FIG. 4 is an enlarged plan view of the inner layer circuit board of the present invention. FIG. 5 is a cross-sectional view of the multilayer printed wiring board. Explanation of symbols: 1...Metal foil, 2...Clearance portion, 6...Paris, 7...Metal layer, 9...Inner layer circuit board, 8...Paris.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多数の切欠部であるクリアランス部２を形成した金属層
１を有す内層回路板に於て、クリアランス部内に、電気
的に絶縁されるに足る間隙をあけて、金属層７を設けた
ことを特徴とする多層印刷配線板用内層回路板。In an inner layer circuit board having a metal layer 1 having a plurality of clearance parts 2 formed therein, a metal layer 7 is provided in the clearance part with a gap sufficient for electrical insulation. Features: Inner layer circuit board for multilayer printed wiring boards.
JP7282483U 1983-05-16 1983-05-16 Inner layer circuit board for multilayer printed wiring board Pending JPS59177973U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7282483U JPS59177973U (en) 1983-05-16 1983-05-16 Inner layer circuit board for multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7282483U JPS59177973U (en) 1983-05-16 1983-05-16 Inner layer circuit board for multilayer printed wiring board

Publications (1)

Publication Number Publication Date
JPS59177973U true JPS59177973U (en) 1984-11-28

Family

ID=30202962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7282483U Pending JPS59177973U (en) 1983-05-16 1983-05-16 Inner layer circuit board for multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPS59177973U (en)

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