JPS6435775U - - Google Patents
Info
- Publication number
- JPS6435775U JPS6435775U JP13060487U JP13060487U JPS6435775U JP S6435775 U JPS6435775 U JP S6435775U JP 13060487 U JP13060487 U JP 13060487U JP 13060487 U JP13060487 U JP 13060487U JP S6435775 U JPS6435775 U JP S6435775U
- Authority
- JP
- Japan
- Prior art keywords
- electrical component
- component insertion
- printed wiring
- insertion hole
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａ，ｂは本考案の第１の実施例を説明す
るための工程順に示した平面図、第２図ａ，ｂは
本考案の第２の実施例を説明するための工程順に
示した平面図、第３図ａ，ｂは本考案の第３の実
施例を説明するための工程順に示した平面図、第
４図は本考案の第４の実施例を説明するための平
面図、第５図ａ，ｂは従来の印刷配線板の電気部
品挿入孔の一例を示す平面図及びＡ―Ａ′線断面
図、第６図ａ，ｂは従来の印刷配線板の電気部品
挿入孔の他の例を示す平面図及びＢ―Ｂ′線断面
図、第７図ａ〜ｄはテンテイング工法による製造
工程を説明するための断面図である。
１……印刷配線板、２……銅箔、３……電気部
品挿入孔、４……スルーホール導通孔、５……貫
通孔、６……スルーホールめつき層、７……ラミ
ネート層、１３……電気部品挿入孔、１４……ス
ルーホール導通孔、２３，３３，４３，５３……
電気部品挿入孔。
Figures 1a and b are plan views showing the order of steps to explain the first embodiment of the present invention, and Figures 2a and b are plan views showing the order of steps to explain the second embodiment of the invention. FIGS. 3a and 3b are plan views showing the order of steps for explaining the third embodiment of the present invention, and FIG. 4 is a plan view for explaining the fourth embodiment of the present invention. , FIGS. 5a and 5b are a plan view and a cross-sectional view taken along the line A-A' showing an example of an electrical component insertion hole in a conventional printed wiring board, and FIGS. 6a and 6b are an example of an electrical component insertion hole in a conventional printed wiring board. A plan view and a sectional view taken along the line B-B' showing another example, and FIGS. 7a to 7d are sectional views for explaining the manufacturing process by the tenting method. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Copper foil, 3... Electrical component insertion hole, 4... Through-hole conduction hole, 5... Through hole, 6... Through-hole plating layer, 7... Laminate layer, 13...Electrical component insertion hole, 14...Through hole conduction hole, 23, 33, 43, 53...
Electrical component insertion hole.
Claims (1)
前記電気部品挿入孔が複数の円弧の連続接続部分
を外周の少くとも一部に有することを特徴とする
印刷配線板。 In printed wiring boards with electrical component insertion holes,
A printed wiring board characterized in that the electrical component insertion hole has a plurality of circular arc continuous connection parts on at least a part of its outer periphery.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13060487U JPS6435775U (en) | 1987-08-26 | 1987-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13060487U JPS6435775U (en) | 1987-08-26 | 1987-08-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6435775U true JPS6435775U (en) | 1989-03-03 |
Family
ID=31385924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13060487U Pending JPS6435775U (en) | 1987-08-26 | 1987-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6435775U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019161204A (en) * | 2018-03-16 | 2019-09-19 | 株式会社 大昌電子 | Method for forming via hole in printed wiring board, filled via structure in printed wiring board, and printed wiring board |
-
1987
- 1987-08-26 JP JP13060487U patent/JPS6435775U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019161204A (en) * | 2018-03-16 | 2019-09-19 | 株式会社 大昌電子 | Method for forming via hole in printed wiring board, filled via structure in printed wiring board, and printed wiring board |
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