JPS63155669U - - Google Patents
Info
- Publication number
- JPS63155669U JPS63155669U JP4890687U JP4890687U JPS63155669U JP S63155669 U JPS63155669 U JP S63155669U JP 4890687 U JP4890687 U JP 4890687U JP 4890687 U JP4890687 U JP 4890687U JP S63155669 U JPS63155669 U JP S63155669U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- multilayer printed
- wiring board
- printed wiring
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の第１の実施例の断面図、第２
図は第１図の多層印刷配線板に部品を実装したと
きの断面図、第３図は本考案の第２の実施例の断
面図、第４図は従来の多層印刷配線板の一例の断
面図、第５図は第４図の多層印刷配線板に部品を
実装したときの断面図である。
１……スルーホール、２……部品、３……ラン
ド、４……絶縁基板、５……リード、６……はん
だ、７……内層銅箔、１１……第１の穴、１２…
…部品、１５……リード、２２……部品、２５…
…リード、３１，４１……スルーホール、４２…
…部品、４５……リード。
Fig. 1 is a sectional view of the first embodiment of the present invention;
The figure is a sectional view of the multilayer printed wiring board shown in Fig. 1 when components are mounted, Fig. 3 is a sectional view of the second embodiment of the present invention, and Fig. 4 is a sectional view of an example of a conventional multilayer printed wiring board. FIG. 5 is a sectional view when components are mounted on the multilayer printed wiring board of FIG. 4. DESCRIPTION OF SYMBOLS 1...Through hole, 2...Component, 3...Land, 4...Insulating board, 5...Lead, 6...Solder, 7...Inner layer copper foil, 11...First hole, 12...
...Parts, 15...Leads, 22...Parts, 25...
...Lead, 31, 41...Through hole, 42...
...Parts, 45...Lead.
Claims (1)
層印刷配線板において、表面に設けられた底を有
する第１の穴と裏面の前記第１の穴と同じ位置に
対応して設けられた底を有する第２の穴がいずれ
の穴の直径よりも小さい直径の貫通孔で連結され
たスルーホールを有することを特徴とする多層印
刷配線板。 In a multilayer printed wiring board in which insulating layers and wiring layers are alternately laminated, a first hole having a bottom is provided on the front surface and a first hole is provided on the back surface at the same position as the first hole. A multilayer printed wiring board characterized in that the second hole having a bottom has a through hole connected by a through hole having a diameter smaller than the diameter of either hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4890687U JPS63155669U (en) | 1987-03-30 | 1987-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4890687U JPS63155669U (en) | 1987-03-30 | 1987-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63155669U true JPS63155669U (en) | 1988-10-12 |
Family
ID=30870876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4890687U Pending JPS63155669U (en) | 1987-03-30 | 1987-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63155669U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02137295A (en) * | 1988-11-17 | 1990-05-25 | Ibiden Co Ltd | Multilayer printed wiring board |
| JPH02114963U (en) * | 1989-03-03 | 1990-09-14 | ||
| JP2013074154A (en) * | 2011-09-28 | 2013-04-22 | Hitachi Chemical Co Ltd | Multilayer wiring board and manufacturing method of the same |
-
1987
- 1987-03-30 JP JP4890687U patent/JPS63155669U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02137295A (en) * | 1988-11-17 | 1990-05-25 | Ibiden Co Ltd | Multilayer printed wiring board |
| JPH02114963U (en) * | 1989-03-03 | 1990-09-14 | ||
| JP2013074154A (en) * | 2011-09-28 | 2013-04-22 | Hitachi Chemical Co Ltd | Multilayer wiring board and manufacturing method of the same |
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