JPH0197581U - - Google Patents
Info
- Publication number
- JPH0197581U JPH0197581U JP19286387U JP19286387U JPH0197581U JP H0197581 U JPH0197581 U JP H0197581U JP 19286387 U JP19286387 U JP 19286387U JP 19286387 U JP19286387 U JP 19286387U JP H0197581 U JPH0197581 U JP H0197581U
- Authority
- JP
- Japan
- Prior art keywords
- attached
- circuit board
- printed circuit
- layer
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の積層プリント基板を表面実
装部品を取付けた状態で示す側断面図、第２図は
部品取付け前の状態を示す側断面図、第３図は内
層と外層を積層添着以前の個別の状態で示した側
断面図、第４図は従来の積層プリント基板を実装
部品を取付けた状態で示す側断面図である。
１…銅箔、２…絶縁基板、３…外層、４…内層
、５…表面実装部品、７…穿孔。
Figure 1 is a side sectional view showing the laminated printed circuit board of this invention with surface mount components attached, Figure 2 is a side sectional view showing the state before components are attached, and Figure 3 is before the inner and outer layers are laminated and attached. FIG. 4 is a side sectional view showing a conventional laminated printed circuit board with mounted components attached. 1...Copper foil, 2...Insulating substrate, 3...Outer layer, 4...Inner layer, 5...Surface mount component, 7...Perforation.
Claims (1)
て成る多層プリント基板において、表面実装部品
を取り付けるべき位置の最外層をその実装部品に
対応した寸法、形状に穿孔したことを特徴とする
多層プリント基板。 A multilayer printed circuit board comprising at least one outer layer attached to each side of an inner layer, characterized in that the outermost layer at a position where a surface mount component is to be attached is perforated in a size and shape corresponding to the mounted component. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19286387U JPH0197581U (en) | 1987-12-19 | 1987-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19286387U JPH0197581U (en) | 1987-12-19 | 1987-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0197581U true JPH0197581U (en) | 1989-06-29 |
Family
ID=31483694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19286387U Pending JPH0197581U (en) | 1987-12-19 | 1987-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0197581U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07170050A (en) * | 1993-12-15 | 1995-07-04 | Nec Corp | Semiconductor device |
| JPH07321439A (en) * | 1994-05-27 | 1995-12-08 | O K Print:Kk | Component mounting board for memory device |
-
1987
- 1987-12-19 JP JP19286387U patent/JPH0197581U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07170050A (en) * | 1993-12-15 | 1995-07-04 | Nec Corp | Semiconductor device |
| JPH07321439A (en) * | 1994-05-27 | 1995-12-08 | O K Print:Kk | Component mounting board for memory device |