JPS61136581U - - Google Patents
Info
- Publication number
- JPS61136581U JPS61136581U JP1918185U JP1918185U JPS61136581U JP S61136581 U JPS61136581 U JP S61136581U JP 1918185 U JP1918185 U JP 1918185U JP 1918185 U JP1918185 U JP 1918185U JP S61136581 U JPS61136581 U JP S61136581U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- crossover
- insulating film
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案のクロスオーバー印刷配線板の
一実施例の一部分を示した断面図、第２図は従来
のクロスオーバー印刷配線板の一部分の断面図。
１０……絶縁基板、１１……導体回路、１２ａ
……第１の絶縁皮膜層、１２ｂ……第２の絶縁皮
膜層、１２ｃ……第３の絶縁皮膜層、１３ａ……
第１の絶縁皮膜層に形成した透孔、１３ｂ……第
２の絶縁皮膜層に形成した透孔、１３ｃ……第３
の絶縁皮膜層に形成した透孔、１４……クロスオ
ーバー回路。
FIG. 1 is a sectional view of a portion of an embodiment of the crossover printed wiring board of the present invention, and FIG. 2 is a sectional view of a portion of a conventional crossover printed wiring board. 10...Insulating substrate, 11...Conductor circuit, 12a
...First insulating film layer, 12b... Second insulating film layer, 12c... Third insulating film layer, 13a...
A through hole formed in the first insulating film layer, 13b... a through hole formed in the second insulating film layer, 13c... a third
A through hole formed in the insulating film layer, 14...Crossover circuit.
Claims (1)
ロスオーバー回路を接続するための透孔の形成さ
れた絶縁層を介して、導電性ペイントの印刷によ
り前記導体回路と接続されたクロスオーバー回路
を設けて成るクロスオーバー印刷配線板において
、 前記絶縁層は複数の絶縁皮膜層の積層によつて
構成されたものであり、かつ前記透孔は、導体回
路側に積層される絶縁皮膜層には小さく、クロス
オーバー回路側に積層される絶縁皮膜層となるに
したがつて順次大きな孔径となるように形成され
たものであることを特徴とするクロスオーバー印
刷配線板。[Claims for Utility Model Registration] The conductive circuit is printed on the conductive circuit surface of the printed wiring board through an insulating layer in which through holes are formed to connect the conductive circuit and the crossover circuit. In a crossover printed wiring board provided with a crossover circuit connected to a circuit, the insulating layer is constituted by laminating a plurality of insulating film layers, and the through hole is located on the conductor circuit side. A crossover printed wiring board characterized in that the pores are formed so that the pores are small in the insulating film layers to be laminated and gradually become larger as the insulating film layers are laminated on the crossover circuit side. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985019181U JPH0231799Y2 (en) | 1985-02-15 | 1985-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985019181U JPH0231799Y2 (en) | 1985-02-15 | 1985-02-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61136581U true JPS61136581U (en) | 1986-08-25 |
| JPH0231799Y2 JPH0231799Y2 (en) | 1990-08-28 |
Family
ID=30508518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985019181U Expired JPH0231799Y2 (en) | 1985-02-15 | 1985-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231799Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49121063U (en) * | 1973-02-12 | 1974-10-17 | ||
| JPS5154785A (en) * | 1974-11-08 | 1976-05-14 | Nippon Electric Co | KUROSUOOBAA |
-
1985
- 1985-02-15 JP JP1985019181U patent/JPH0231799Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49121063U (en) * | 1973-02-12 | 1974-10-17 | ||
| JPS5154785A (en) * | 1974-11-08 | 1976-05-14 | Nippon Electric Co | KUROSUOOBAA |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231799Y2 (en) | 1990-08-28 |