JPS619873U - Thick film printed multilayer substrate - Google Patents
Thick film printed multilayer substrateInfo
- Publication number
- JPS619873U JPS619873U JP9184884U JP9184884U JPS619873U JP S619873 U JPS619873 U JP S619873U JP 9184884 U JP9184884 U JP 9184884U JP 9184884 U JP9184884 U JP 9184884U JP S619873 U JPS619873 U JP S619873U
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- film printed
- printed multilayer
- multilayer substrate
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【図面の簡単な説明】
第１図および第２図は従来の厚膜印刷多層基板をそれぞ
れ示す導通孔部分の主要断面図、第３図は本考案の一実
施例による厚膜印刷多層基板を示す導通孔部分の主要断
面図、第４図は本考案の他の実施例による導通孔部分の
主要断面図である。
１・・・基材、２・・・導体回路層、３・・・絶縁層、
４，４ａ・・・導通孔。[BRIEF DESCRIPTION OF THE DRAWINGS] FIGS. 1 and 2 are main cross-sectional views of the through hole portions of conventional thick film printed multilayer boards, respectively, and FIG. 3 is a thick film printed multilayer board according to an embodiment of the present invention. FIG. 4 is a main sectional view of a through hole portion according to another embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Base material, 2... Conductor circuit layer, 3... Insulating layer,
4, 4a... Conduction hole.
Claims (1)
交互に積層して形成される厚膜印刷多層基板において、
前記各層の上下で対になっている接続導体回路層間をつ
なぐ導通孔を複数個配置したことを特徴とする厚膜印刷
多層基板。In a thick film printed multilayer board formed by alternately laminating conductor circuit layers and insulating layers on a substrate made of ceramic,
A thick film printed multilayer board characterized in that a plurality of conductive holes are arranged to connect the connecting conductor circuit layers that are paired above and below each of the layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9184884U JPS619873U (en) | 1984-06-20 | 1984-06-20 | Thick film printed multilayer substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9184884U JPS619873U (en) | 1984-06-20 | 1984-06-20 | Thick film printed multilayer substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS619873U true JPS619873U (en) | 1986-01-21 |
Family
ID=30648100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9184884U Pending JPS619873U (en) | 1984-06-20 | 1984-06-20 | Thick film printed multilayer substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS619873U (en) |
-
1984
- 1984-06-20 JP JP9184884U patent/JPS619873U/en active Pending
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