JPS6351478U - - Google Patents
Info
- Publication number
- JPS6351478U JPS6351478U JP14509586U JP14509586U JPS6351478U JP S6351478 U JPS6351478 U JP S6351478U JP 14509586 U JP14509586 U JP 14509586U JP 14509586 U JP14509586 U JP 14509586U JP S6351478 U JPS6351478 U JP S6351478U
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- insulating plate
- copper plating
- wiring board
- edge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000003054 catalyst Substances 0.000 claims 1
Description
第１図は本考案の斜視図、第２図は絶縁板にパ
ンチ加工した状態を示す斜視図、第３図は凸起部
に銅めつきが形成された状態を示す斜視図である
。
図面において、１：絶縁板、２：端縁部、３：
凸起部、４：接着剤、５：めつきレジスト層、６
：銅めつき層、１０：配線板。
FIG. 1 is a perspective view of the present invention, FIG. 2 is a perspective view showing an insulating plate punched, and FIG. 3 is a perspective view showing a state in which copper plating is formed on the protrusion. In the drawings, 1: insulating plate, 2: edge, 3:
Convex portion, 4: Adhesive, 5: Plating resist layer, 6
: Copper plating layer, 10: Wiring board.
Claims (1)
の表面に触媒入り接着剤を設け、この凸起部を覆
つて銅めつきを被覆して導電回路を形成すること
を特徴とする印刷配線板。 A conductive circuit is formed by forming a protrusion on the edge of the insulating plate, applying a catalyst-containing adhesive on the surface of the insulating plate, and covering the protrusion with copper plating. Printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14509586U JPS6351478U (en) | 1986-09-24 | 1986-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14509586U JPS6351478U (en) | 1986-09-24 | 1986-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6351478U true JPS6351478U (en) | 1988-04-07 |
Family
ID=31056314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14509586U Pending JPS6351478U (en) | 1986-09-24 | 1986-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6351478U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07170045A (en) * | 1993-12-14 | 1995-07-04 | Nec Corp | Printed-wiring board and manufacture thereof |
-
1986
- 1986-09-24 JP JP14509586U patent/JPS6351478U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07170045A (en) * | 1993-12-14 | 1995-07-04 | Nec Corp | Printed-wiring board and manufacture thereof |
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