JPH01110495U - - Google Patents

Info

Publication number
JPH01110495U
JPH01110495U JP514888U JP514888U JPH01110495U JP H01110495 U JPH01110495 U JP H01110495U JP 514888 U JP514888 U JP 514888U JP 514888 U JP514888 U JP 514888U JP H01110495 U JPH01110495 U JP H01110495U
Authority
JP
Japan
Prior art keywords
metal substrate
conductor pattern
printed wiring
wiring board
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP514888U
Other languages
Japanese (ja)
Other versions
JPH0617331Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP514888U priority Critical patent/JPH0617331Y2/en
Publication of JPH01110495U publication Critical patent/JPH01110495U/ja
Application granted granted Critical
Publication of JPH0617331Y2 publication Critical patent/JPH0617331Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第3図は本考案によるプリント配
線板のそれぞれ異なる実施例を示す断面図、第4
図ないし第6図はそれぞれ従来のプリント配線板
の従来を示す断面図である。
1 to 3 are cross-sectional views showing different embodiments of the printed wiring board according to the present invention, and FIG.
6 through 6 are sectional views showing conventional printed wiring boards, respectively.

Claims (1)

【実用新案登録請求の範囲】 1 金属基板上に絶縁層を介して導体パターンを
形成したプリント配線板において、前記金属基板
、絶縁層および導体パターンからなる3層の一部
をプレスにより導体パターン側に突出させ、該突
出部分の側面と前記導体パターンとの接触により
、前記金属基板と前記導体パターンとを電気的に
接続させた金属基板を用いたプリント配線板。 2 前記突出部分の導体パターン側を押し潰した
請求項1記載の金属基板を用いたプリント配線板
。 3 前記突出部分と前記導体パターンとを半田に
よりさらに電気的に接続した請求項1または2に
記載の金属基板を用いたプリント配線板。
[Claims for Utility Model Registration] 1. In a printed wiring board in which a conductor pattern is formed on a metal substrate via an insulating layer, a part of the three layers consisting of the metal substrate, the insulating layer and the conductor pattern is pressed so that the conductor pattern side 1. A printed wiring board using a metal substrate which is made to protrude and electrically connect the metal substrate and the conductor pattern by contacting the side surface of the protrusion with the conductor pattern. 2. A printed wiring board using the metal substrate according to claim 1, wherein the conductor pattern side of the protruding portion is crushed. 3. The printed wiring board using the metal substrate according to claim 1 or 2, wherein the protruding portion and the conductive pattern are further electrically connected by solder.
JP514888U 1988-01-19 1988-01-19 Printed wiring board using metal substrate Expired - Lifetime JPH0617331Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP514888U JPH0617331Y2 (en) 1988-01-19 1988-01-19 Printed wiring board using metal substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP514888U JPH0617331Y2 (en) 1988-01-19 1988-01-19 Printed wiring board using metal substrate

Publications (2)

Publication Number Publication Date
JPH01110495U true JPH01110495U (en) 1989-07-26
JPH0617331Y2 JPH0617331Y2 (en) 1994-05-02

Family

ID=31208269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP514888U Expired - Lifetime JPH0617331Y2 (en) 1988-01-19 1988-01-19 Printed wiring board using metal substrate

Country Status (1)

Country Link
JP (1) JPH0617331Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03201498A (en) * 1989-12-28 1991-09-03 Matsushita Electric Ind Co Ltd Metal board interconnection

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03201498A (en) * 1989-12-28 1991-09-03 Matsushita Electric Ind Co Ltd Metal board interconnection

Also Published As

Publication number Publication date
JPH0617331Y2 (en) 1994-05-02

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