JPH01110495U - - Google Patents
Info
- Publication number
- JPH01110495U JPH01110495U JP514888U JP514888U JPH01110495U JP H01110495 U JPH01110495 U JP H01110495U JP 514888 U JP514888 U JP 514888U JP 514888 U JP514888 U JP 514888U JP H01110495 U JPH01110495 U JP H01110495U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- conductor pattern
- printed wiring
- wiring board
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 229910000679 solder Inorganic materials 0.000 claims 1
Description
第1図ないし第3図は本考案によるプリント配
線板のそれぞれ異なる実施例を示す断面図、第4
図ないし第6図はそれぞれ従来のプリント配線板
の従来を示す断面図である。
1 to 3 are cross-sectional views showing different embodiments of the printed wiring board according to the present invention, and FIG.
6 through 6 are sectional views showing conventional printed wiring boards, respectively.
Claims (1)
形成したプリント配線板において、前記金属基板
、絶縁層および導体パターンからなる3層の一部
をプレスにより導体パターン側に突出させ、該突
出部分の側面と前記導体パターンとの接触により
、前記金属基板と前記導体パターンとを電気的に
接続させた金属基板を用いたプリント配線板。 2 前記突出部分の導体パターン側を押し潰した
請求項1記載の金属基板を用いたプリント配線板
。 3 前記突出部分と前記導体パターンとを半田に
よりさらに電気的に接続した請求項1または2に
記載の金属基板を用いたプリント配線板。[Claims for Utility Model Registration] 1. In a printed wiring board in which a conductor pattern is formed on a metal substrate via an insulating layer, a part of the three layers consisting of the metal substrate, the insulating layer and the conductor pattern is pressed so that the conductor pattern side 1. A printed wiring board using a metal substrate which is made to protrude and electrically connect the metal substrate and the conductor pattern by contacting the side surface of the protrusion with the conductor pattern. 2. A printed wiring board using the metal substrate according to claim 1, wherein the conductor pattern side of the protruding portion is crushed. 3. The printed wiring board using the metal substrate according to claim 1 or 2, wherein the protruding portion and the conductive pattern are further electrically connected by solder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP514888U JPH0617331Y2 (en) | 1988-01-19 | 1988-01-19 | Printed wiring board using metal substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP514888U JPH0617331Y2 (en) | 1988-01-19 | 1988-01-19 | Printed wiring board using metal substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01110495U true JPH01110495U (en) | 1989-07-26 |
JPH0617331Y2 JPH0617331Y2 (en) | 1994-05-02 |
Family
ID=31208269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP514888U Expired - Lifetime JPH0617331Y2 (en) | 1988-01-19 | 1988-01-19 | Printed wiring board using metal substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0617331Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03201498A (en) * | 1989-12-28 | 1991-09-03 | Matsushita Electric Ind Co Ltd | Metal board interconnection |
-
1988
- 1988-01-19 JP JP514888U patent/JPH0617331Y2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03201498A (en) * | 1989-12-28 | 1991-09-03 | Matsushita Electric Ind Co Ltd | Metal board interconnection |
Also Published As
Publication number | Publication date |
---|---|
JPH0617331Y2 (en) | 1994-05-02 |
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