JPH02140868U - - Google Patents
Info
- Publication number
- JPH02140868U JPH02140868U JP4955589U JP4955589U JPH02140868U JP H02140868 U JPH02140868 U JP H02140868U JP 4955589 U JP4955589 U JP 4955589U JP 4955589 U JP4955589 U JP 4955589U JP H02140868 U JPH02140868 U JP H02140868U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- circuit board
- insulating layer
- printed circuit
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
図−１ないし図−５はそれぞれ本考案に係る金
属基板付きプリント回路基板の実施例を示す断面
図である。
１……金属基板、２・２ａ・２ｂ……絶縁層、
３……回路パターン、３ａ……接地導体、３ｂ…
…信号導体、４……シールド層、５……層間接続
導体、６……孔、７……ボンデイングワイヤ、８
……内面銅メツキ、９……導電ペースト。
FIGS. 1 to 5 are cross-sectional views showing embodiments of a printed circuit board with a metal substrate according to the present invention. 1... Metal substrate, 2, 2a, 2b... Insulating layer,
3...Circuit pattern, 3a...Grounding conductor, 3b...
... Signal conductor, 4 ... Shield layer, 5 ... Interlayer connection conductor, 6 ... Hole, 7 ... Bonding wire, 8
...Inner surface copper plating, 9...Conductive paste.
Claims (1)
成してなる金属基板付きプリント回路基板におい
て、上記絶縁層内にシールド層を設け、そのシー
ルド層と上記回路パターンの接地導体とを電気的
に接続したことを特徴とする金属基板付きプリン
ト回路基板。 In a printed circuit board with a metal substrate in which a circuit pattern is formed on a metal substrate via an insulating layer, a shield layer is provided within the insulating layer, and the shield layer and the ground conductor of the circuit pattern are electrically connected. A printed circuit board with a metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4955589U JPH02140868U (en) | 1989-04-28 | 1989-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4955589U JPH02140868U (en) | 1989-04-28 | 1989-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02140868U true JPH02140868U (en) | 1990-11-26 |
Family
ID=31567343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4955589U Pending JPH02140868U (en) | 1989-04-28 | 1989-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02140868U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003097997A (en) * | 2001-09-27 | 2003-04-03 | Matsushita Electric Ind Co Ltd | Weight sensor |
-
1989
- 1989-04-28 JP JP4955589U patent/JPH02140868U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003097997A (en) * | 2001-09-27 | 2003-04-03 | Matsushita Electric Ind Co Ltd | Weight sensor |
| JP4529337B2 (en) * | 2001-09-27 | 2010-08-25 | パナソニック株式会社 | Weight sensor |