JPH0195796U - - Google Patents
Info
- Publication number
- JPH0195796U JPH0195796U JP19072787U JP19072787U JPH0195796U JP H0195796 U JPH0195796 U JP H0195796U JP 19072787 U JP19072787 U JP 19072787U JP 19072787 U JP19072787 U JP 19072787U JP H0195796 U JPH0195796 U JP H0195796U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal foil
- conductive paste
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 7
- 239000000463 material Substances 0.000 claims 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000005007 epoxy-phenolic resin Substances 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図、第３図は本考案の代表的実施態様を示
す夫々斜視図、平面図である。また、第２図は従
来の態様を示す断面図である。
１は基板、２は信号パターン部銅箔層、２′は
アースパターン部銅箔層、３はアンダーコート層
、４は銅ペースト層、４′は線条銅ペースト、４
″は散点状銅ペースト及び５はオーバーコート層
である。
1 and 3 are a perspective view and a plan view, respectively, showing typical embodiments of the present invention. Moreover, FIG. 2 is a sectional view showing a conventional aspect. 1 is a substrate, 2 is a signal pattern copper foil layer, 2' is a ground pattern copper foil layer, 3 is an undercoat layer, 4 is a copper paste layer, 4' is a wire copper paste, 4
'' is a dotted copper paste and 5 is an overcoat layer.
Claims (1)
され、該パターン部上に導電性ペースト層が絶縁
層を介して被覆され部分的に導電性ペースト層と
金属箔層とが直接接続されてなるプリント配線板
において、該導電性ペースト層と金属箔層とが直
接接続されてなる部分の接続態様が、該部分内部
において導電性ペースト層と金属箔層とが散線点
状に直接接続され、残部が導電性ペースト層、金
属箔層の両者に接着性の良好な素材からなるアン
ダーコート層を介して導電性ペースト層と金属箔
層とが間接的に接着されてなることを特徴とする
プリント配線板。 (2) 散線点状が散点状、格子状又は複数の線条
状である実用新案登録請求の範囲第１項記載のプ
リント配線板。 (3) 金属箔層が銅箔層である実用新案登録請求
の範囲第１項記載のプリント配線板。 (4) 導電性ペースト層が銅又は銀系のペースト
層である実用新案登録請求の範囲第１項記載のプ
リント配線板。 (5) アンダーコート層がエポキシ樹脂又はフエ
ノール樹脂を主成分とする素材からなるアンダー
コート層である実用新案登録請求の範囲第１項記
載のプリント配線板。[Claims for Utility Model Registration] (1) A signal pattern, etc. is formed on a metal foil layer on a substrate, and a conductive paste layer is partially covered with an insulating layer on the pattern part. In a printed wiring board in which the conductive paste layer and the metal foil layer are directly connected, the connection mode of the part where the conductive paste layer and the metal foil layer are directly connected is such that the conductive paste layer and the metal foil layer are connected to each other inside the part. are directly connected in the form of scattered dots, and the remaining part is indirectly connected to the conductive paste layer and the metal foil layer through an undercoat layer made of a material with good adhesion to both the conductive paste layer and the metal foil layer. A printed wiring board characterized by being bonded. (2) The printed wiring board according to claim 1, wherein the scattered dots are in the form of dots, a grid, or a plurality of lines. (3) The printed wiring board according to claim 1, wherein the metal foil layer is a copper foil layer. (4) The printed wiring board according to claim 1, wherein the conductive paste layer is a copper- or silver-based paste layer. (5) The printed wiring board according to claim 1, wherein the undercoat layer is made of a material whose main component is epoxy resin or phenolic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987190727U JPH0611595Y2 (en) | 1987-12-17 | 1987-12-17 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987190727U JPH0611595Y2 (en) | 1987-12-17 | 1987-12-17 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0195796U true JPH0195796U (en) | 1989-06-26 |
| JPH0611595Y2 JPH0611595Y2 (en) | 1994-03-23 |
Family
ID=31481674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987190727U Expired - Lifetime JPH0611595Y2 (en) | 1987-12-17 | 1987-12-17 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611595Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013045849A (en) * | 2011-08-23 | 2013-03-04 | Dainippon Printing Co Ltd | Wiring board with built-in chip inductor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831428U (en) * | 1981-08-26 | 1983-03-01 | 日本精工株式会社 | track guide bearing |
| JPS5837169U (en) * | 1981-09-02 | 1983-03-10 | ソニー株式会社 | circuit board |
-
1987
- 1987-12-17 JP JP1987190727U patent/JPH0611595Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831428U (en) * | 1981-08-26 | 1983-03-01 | 日本精工株式会社 | track guide bearing |
| JPS5837169U (en) * | 1981-09-02 | 1983-03-10 | ソニー株式会社 | circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013045849A (en) * | 2011-08-23 | 2013-03-04 | Dainippon Printing Co Ltd | Wiring board with built-in chip inductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0611595Y2 (en) | 1994-03-23 |
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