JPH028080U - - Google Patents
Info
- Publication number
- JPH028080U JPH028080U JP8475988U JP8475988U JPH028080U JP H028080 U JPH028080 U JP H028080U JP 8475988 U JP8475988 U JP 8475988U JP 8475988 U JP8475988 U JP 8475988U JP H028080 U JPH028080 U JP H028080U
- Authority
- JP
- Japan
- Prior art keywords
- land
- component mounting
- wiring board
- printed wiring
- extension part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図および第２図は本考案の一実施例を示す
図であつて、第１図はその下部平面図、第２図は
半田付けをした状態を示す断面図、第３図および
第４図は従来のランドを示す図であつて、第３図
はその下部平面図、第４図は半田付けをした状態
を示す断面図である。
２２……部品取付孔、２３……部品取付ランド
、２５……ランド本体、２６……延在部、２７…
…被膜。
1 and 2 are views showing one embodiment of the present invention, in which FIG. 1 is a plan view of the lower part thereof, FIG. 2 is a sectional view showing the soldered state, and FIGS. The figures show a conventional land, with FIG. 3 being a plan view of the lower part thereof, and FIG. 4 being a sectional view showing the soldered state. 22...Component mounting hole, 23...Component mounting land, 25...Land body, 26...Extension portion, 27...
...film.
Claims (1)
形成されたプリント配線板において、前記ランド
本体に、剥離強度を増加させるための延在部を形
成し、前記ランド本体と前記延在部とを部品取付
ランドとし、この部品取付ランドに絶縁体を被覆
したことを特徴とするプリント配線板。 In a printed wiring board in which a land body made of copper foil is formed around a component mounting hole, an extension part is formed in the land body to increase peel strength, and the land body and the extension part are connected to each other. A printed wiring board characterized by having a component mounting land and covering the component mounting land with an insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8475988U JPH028080U (en) | 1988-06-27 | 1988-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8475988U JPH028080U (en) | 1988-06-27 | 1988-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028080U true JPH028080U (en) | 1990-01-18 |
Family
ID=31309440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8475988U Pending JPH028080U (en) | 1988-06-27 | 1988-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028080U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100346679C (en) * | 2000-12-08 | 2007-10-31 | 日本电气株式会社 | Circuit board, electronic equipment using the circuit board and method of sorting circuit board |
-
1988
- 1988-06-27 JP JP8475988U patent/JPH028080U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100346679C (en) * | 2000-12-08 | 2007-10-31 | 日本电气株式会社 | Circuit board, electronic equipment using the circuit board and method of sorting circuit board |