JPS64366U - - Google Patents
Info
- Publication number
- JPS64366U JPS64366U JP9343487U JP9343487U JPS64366U JP S64366 U JPS64366 U JP S64366U JP 9343487 U JP9343487 U JP 9343487U JP 9343487 U JP9343487 U JP 9343487U JP S64366 U JPS64366 U JP S64366U
- Authority
- JP
- Japan
- Prior art keywords
- conductive foil
- circuit board
- printed circuit
- flexible printed
- base film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は第１のフレキシブルプリント回路基板の要部
平面図、第３図および第４図は従来の接続構造を
示す断面図および半田前の斜視図である。
１……第１のフレキシブルプリント回路基板、
２……第２のフレキシブルプリント回路基板、３
……半田、４，８……ベースフイルム、５，９…
…導電箔、５ａ，９ａ……ランド部、６，１０…
…オーバーレイフイルム、７……開口、１１……
半田用挿通孔、１２……開口、２０……スリツト
。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a plan view of a main part of the first flexible printed circuit board, and FIGS. 3 and 4 are a sectional view and a perspective view before soldering, respectively, showing a conventional connection structure. 1...first flexible printed circuit board,
2...Second flexible printed circuit board, 3
...Solder, 4,8...Base film, 5,9...
...Conductive foil, 5a, 9a... Land portion, 6, 10...
...Overlay film, 7...Opening, 11...
Solder insertion hole, 12... opening, 20... slit.
Claims (1)
の上にオーバーレイフイルムを被覆し、前記導電
箔のランド部に前記ベースフイルムの表面に達す
るスリツトを設けると共にこのスリツトに対応し
て前記オーバーレイフイルムに該スリツトより大
きな開口を設けてなる第１のフレキシブルプリン
ト回路基板と、ベースフイルム上に導電箔を形成
し、さらにその上にオーバーレイフイルムを被覆
し、前記導電箔のランド部に前記ベースフイルム
の下面に開口する半田用挿通孔を形成すると共に
この挿通孔に対応して前記オーバーレイフイルム
に該挿通孔より大きな開口を設けてなる第２のフ
レキシブルプリント回路基板とを備え、この第２
のフレキシブルプリント回路基板を前記第１のフ
レキシブルプリント回路基板上に、両回路基板の
ランド部を一致させて載せ、両ランド部を半田に
より接続するようにしたことを特徴とするフレキ
シブルプリント回路基板の接続構造。 A conductive foil is formed on a base film, an overlay film is further coated on the conductive foil, and a slit is provided in the land portion of the conductive foil to reach the surface of the base film, and a slit is formed in the overlay film corresponding to the slit. A first flexible printed circuit board having a larger opening, a conductive foil formed on a base film, an overlay film coated thereon, and an opening formed on the lower surface of the base film in the land portion of the conductive foil. a second flexible printed circuit board having a solder insertion hole formed therein and an opening larger than the insertion hole in the overlay film corresponding to the insertion hole;
The flexible printed circuit board is placed on the first flexible printed circuit board with land portions of both circuit boards aligned, and both land portions are connected by solder. Connection structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9343487U JPS64366U (en) | 1987-06-19 | 1987-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9343487U JPS64366U (en) | 1987-06-19 | 1987-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS64366U true JPS64366U (en) | 1989-01-05 |
Family
ID=30956017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9343487U Pending JPS64366U (en) | 1987-06-19 | 1987-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS64366U (en) |
-
1987
- 1987-06-19 JP JP9343487U patent/JPS64366U/ja active Pending