JPH02769U - - Google Patents
Info
- Publication number
- JPH02769U JPH02769U JP7752988U JP7752988U JPH02769U JP H02769 U JPH02769 U JP H02769U JP 7752988 U JP7752988 U JP 7752988U JP 7752988 U JP7752988 U JP 7752988U JP H02769 U JPH02769 U JP H02769U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- hole
- bonding structure
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図ないし第５図は、それぞれ、実施例に係
るプリント基板の接合構造における第１のプリン
ト基板の一ランド部を拡大して示す正面図である
。第６図は、従来のプリント基板の接合構造の一
例を示す斜視図である。第７図は、第６図の差し
込み部分を拡大して示す側面図である。
２……第１のプリント基板、４……舌片部、６
，１６……電極パターン、８，１８，２８……ラ
ンド部、１０……半田、１２……第２のプリント
基板、１４……穴、３０……穴、３１〜３３……
スリツト、３４……半田レジスト膜。
1 to 5 are respectively enlarged front views showing one land portion of a first printed circuit board in the printed circuit board bonding structure according to the embodiment. FIG. 6 is a perspective view showing an example of a conventional printed circuit board bonding structure. FIG. 7 is an enlarged side view of the insertion portion of FIG. 6. 2... First printed circuit board, 4... Tongue piece part, 6
, 16... Electrode pattern, 8, 18, 28... Land portion, 10... Solder, 12... Second printed circuit board, 14... Hole, 30... Hole, 31-33...
Slit, 34...Solder resist film.
Claims (1)
れに半田付け用のランド部を設けた第１のプリン
ト基板の当該舌片部を、穴の周辺部に前記各ラン
ド部に対応するように電極パターンを延設した第
２のプリント基板の当該穴に差し込み、両プリン
ト基板の対応するランド部と電極パターン間をそ
れぞれ半田付けするようにしたプリント基板の接
合構造において、前記第１のプリント基板の各ラ
ンド部に、半田付着を妨げる領域を部分的にそれ
ぞれ設けたことを特徴とするプリント基板の接合
構造。 The tongue piece of the first printed circuit board, which has one or more electrode patterns extending from the tongue piece and each having a land part for soldering, is placed around the hole so as to correspond to each land part. In the printed circuit board bonding structure, the electrode pattern is inserted into the hole of the second printed circuit board having an extended electrode pattern, and the corresponding land portions of both printed circuit boards and the electrode patterns are respectively soldered. A printed circuit board bonding structure characterized in that each land portion of the printed circuit board is partially provided with a region that prevents solder adhesion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7752988U JPH0623018Y2 (en) | 1988-06-10 | 1988-06-10 | Printed circuit board joint structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7752988U JPH0623018Y2 (en) | 1988-06-10 | 1988-06-10 | Printed circuit board joint structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02769U true JPH02769U (en) | 1990-01-05 |
| JPH0623018Y2 JPH0623018Y2 (en) | 1994-06-15 |
Family
ID=31302508
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7752988U Expired - Lifetime JPH0623018Y2 (en) | 1988-06-10 | 1988-06-10 | Printed circuit board joint structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0623018Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0683277A (en) * | 1992-09-02 | 1994-03-25 | Riken Light Metal Ind Co Ltd | Backing frame body for large-sized display |
-
1988
- 1988-06-10 JP JP7752988U patent/JPH0623018Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0683277A (en) * | 1992-09-02 | 1994-03-25 | Riken Light Metal Ind Co Ltd | Backing frame body for large-sized display |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0623018Y2 (en) | 1994-06-15 |