JPH01145171U - - Google Patents
Info
- Publication number
- JPH01145171U JPH01145171U JP4156088U JP4156088U JPH01145171U JP H01145171 U JPH01145171 U JP H01145171U JP 4156088 U JP4156088 U JP 4156088U JP 4156088 U JP4156088 U JP 4156088U JP H01145171 U JPH01145171 U JP H01145171U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- sub
- component mounting
- circuit boards
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図はこの考案にかかる部品実装の斜視図、
第２図、第３図、第４図、第５図、第６図はこの
考案にかかる部品実装実施例の部分拡大断面図、
第７図は従来の部品実装実施例の斜視図、第８図
はサイドスルーホールを設けた従回路基板を用い
た従来の部品実装実施例の断面図、第９図はフイ
ンガーリードを設けた従回路基板を用いた従来の
部品実装実施例の断面図である。
１……主回路基板、２……従回路基板、３……
半田、４……従回路基板上のパターン、５……主
回路基板上のパターン、１１……チツプ形状電気
部品、１２……ＳＯＰ，ＱＦＰ、１３……１部の
リードを延ばしたＳＯＰ，ＱＦＰ、１４……ＳＯ
Ｊ。
Figure 1 is a perspective view of component mounting according to this invention.
2, 3, 4, 5, and 6 are partially enlarged sectional views of component mounting examples according to this invention,
Figure 7 is a perspective view of a conventional component mounting example, Figure 8 is a sectional view of a conventional component mounting example using a sub circuit board with side through holes, and Figure 9 is a diagram showing a conventional component mounting example using a sub circuit board with side through holes. FIG. 2 is a cross-sectional view of a conventional component mounting example using a sub-circuit board. 1... Main circuit board, 2... Sub circuit board, 3...
Solder, 4... Pattern on slave circuit board, 5... Pattern on main circuit board, 11... Chip-shaped electrical component, 12... SOP, QFP, 13... SOP, QFP with one lead extended. , 14...S.O.
J.
Claims (1)
電気部品の実装構造において、前記電気部品が前
記２つの回路基板にまたがつて接続されている事
を特徴とする電気部品の実装構造。 1. A structure for mounting electrical components on two circuit boards, a main circuit board and a sub-circuit board, characterized in that the electrical component is connected across the two circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156088U JPH01145171U (en) | 1988-03-29 | 1988-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4156088U JPH01145171U (en) | 1988-03-29 | 1988-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01145171U true JPH01145171U (en) | 1989-10-05 |
Family
ID=31267997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4156088U Pending JPH01145171U (en) | 1988-03-29 | 1988-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01145171U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253506A (en) * | 2005-03-11 | 2006-09-21 | Tdk Corp | Device with compound substrate and its production process |
-
1988
- 1988-03-29 JP JP4156088U patent/JPH01145171U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253506A (en) * | 2005-03-11 | 2006-09-21 | Tdk Corp | Device with compound substrate and its production process |