JPS63195777U - - Google Patents
Info
- Publication number
- JPS63195777U JPS63195777U JP8682487U JP8682487U JPS63195777U JP S63195777 U JPS63195777 U JP S63195777U JP 8682487 U JP8682487 U JP 8682487U JP 8682487 U JP8682487 U JP 8682487U JP S63195777 U JPS63195777 U JP S63195777U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- component mounting
- lead terminals
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図及び第２図は本考案の印刷配線板を示し
、第１図は全体構成図、第２図は部分拡大図、第
３図及び第４図は従来の印刷配線板の一例を示し
、第３図は全体構成図、第４図は部分拡大図であ
る。
１……印刷配線板、２ａ，２ｂ……部品取付け
ランド、４……スルホール、４ａ……導電体、５
ａ，５ｂ……電子部品、５ｃ，５ｄ……リード端
子。
Figures 1 and 2 show the printed wiring board of the present invention, Figure 1 is an overall configuration diagram, Figure 2 is a partially enlarged view, and Figures 3 and 4 are examples of conventional printed wiring boards. , FIG. 3 is an overall configuration diagram, and FIG. 4 is a partially enlarged diagram. 1...Printed wiring board, 2a, 2b...Component mounting land, 4...Through hole, 4a...Conductor, 5
a, 5b...electronic components, 5c, 5d...lead terminals.
Claims (1)
付けランド２ａ，２ｂに電子部品５ａ，５ｂのリ
ード端子５ｃ，５ｄを固着し、該リード端子５ｃ
，５ｄを電気的に接続する導電体４ａが挿通され
るスルホール４が設けられた印刷配線板において
、少なくとも一方の部品取付けランドをスルホー
ルに対応させて導電体４ａの一端にハンダ付けし
たことを特徴とする印刷配線板。 (2) 印刷配線板１はフレキシブル基板より成る
ことを特徴とする実用新案登録請求の範囲第１項
記載の印刷配線板。[Claims for Utility Model Registration] (1) Lead terminals 5c and 5d of electronic components 5a and 5b are fixed to respective component mounting lands 2a and 2b provided on both the front and back surfaces, and the lead terminals 5c
, 5d, in which at least one component mounting land is made to correspond to the through hole and is soldered to one end of the conductor 4a. Printed wiring board. (2) The printed wiring board according to claim 1, wherein the printed wiring board 1 is made of a flexible substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8682487U JPS63195777U (en) | 1987-06-04 | 1987-06-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8682487U JPS63195777U (en) | 1987-06-04 | 1987-06-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63195777U true JPS63195777U (en) | 1988-12-16 |
Family
ID=30943485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8682487U Pending JPS63195777U (en) | 1987-06-04 | 1987-06-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63195777U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0745938A (en) * | 1993-07-30 | 1995-02-14 | Hitachi Aic Inc | Printed-wiring board |
-
1987
- 1987-06-04 JP JP8682487U patent/JPS63195777U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0745938A (en) * | 1993-07-30 | 1995-02-14 | Hitachi Aic Inc | Printed-wiring board |
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