JPH0192175U - - Google Patents
Info
- Publication number
- JPH0192175U JPH0192175U JP18671587U JP18671587U JPH0192175U JP H0192175 U JPH0192175 U JP H0192175U JP 18671587 U JP18671587 U JP 18671587U JP 18671587 U JP18671587 U JP 18671587U JP H0192175 U JPH0192175 U JP H0192175U
- Authority
- JP
- Japan
- Prior art keywords
- flexible printed
- electronic components
- printed board
- cutout
- accommodate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Description
第１図は本考案の一実施例に係るハイブリツド
ＩＣの外観を示す斜視図、第２図は第１図のハイ
ブリツドＩＣの要部拡大断面図、第３図はハイブ
リツドＩＣの変形の一例についての説明図である
。
１……ハイブリツドＩＣ、３，４……面実装型
の電子部品、５Ａ〜５Ｅ……フレキシブルプリン
ト板、７……切り欠き。
FIG. 1 is a perspective view showing the external appearance of a hybrid IC according to an embodiment of the present invention, FIG. 2 is an enlarged cross-sectional view of a main part of the hybrid IC shown in FIG. 1, and FIG. 3 is an example of a modification of the hybrid IC. It is an explanatory diagram. 1...Hybrid IC, 3, 4...Surface-mounted electronic component, 5A to 5E...Flexible printed board, 7...Notch.
Claims (1)
シブルプリント板を、電子部品とフレキシブルプ
リント板との干渉部分にはフレキシブルプリント
板側に電子部品収容のための切り欠きを設けて、
互いに重ね合わせ接合したことを特徴とする混成
集積回路。 Multiple flexible printed boards are mounted with surface-mounted electronic components, and a cutout is provided on the flexible printed board side to accommodate the electronic components at the interference part between the electronic components and the flexible printed board.
A hybrid integrated circuit characterized by being stacked and bonded together.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18671587U JPH0192175U (en) | 1987-12-08 | 1987-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18671587U JPH0192175U (en) | 1987-12-08 | 1987-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0192175U true JPH0192175U (en) | 1989-06-16 |
Family
ID=31477927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18671587U Pending JPH0192175U (en) | 1987-12-08 | 1987-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0192175U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010034390A (en) * | 2008-07-30 | 2010-02-12 | Fujikura Ltd | Multilayer printed wiring board |
-
1987
- 1987-12-08 JP JP18671587U patent/JPH0192175U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010034390A (en) * | 2008-07-30 | 2010-02-12 | Fujikura Ltd | Multilayer printed wiring board |
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