JPS63178374U - - Google Patents

Info

Publication number
JPS63178374U
JPS63178374U JP6883787U JP6883787U JPS63178374U JP S63178374 U JPS63178374 U JP S63178374U JP 6883787 U JP6883787 U JP 6883787U JP 6883787 U JP6883787 U JP 6883787U JP S63178374 U JPS63178374 U JP S63178374U
Authority
JP
Japan
Prior art keywords
electronic component
printed wiring
mounting structure
wiring board
component mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6883787U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6883787U priority Critical patent/JPS63178374U/ja
Publication of JPS63178374U publication Critical patent/JPS63178374U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図a,b,cは本考案の一実施例を示す平
面図及び側面図、第2図a,bは従来例を示す平
面図及び側面図、第3図a,bは本考案の他の実
施例を示す平面図及び側面図、第4図a,bは本
考案の他の実施例を示す平面図及び側面図。 1……印刷配線板、4,5,7,8,9,10
……電子部品、6……溝、11……凹部。
Figures 1 a, b, and c are a plan view and side view showing an embodiment of the present invention, Figures 2 a and b are plan views and side views showing a conventional example, and Figures 3 a and b are views of the present invention. FIGS. 4a and 4b are plan views and side views showing other embodiments of the present invention; FIGS. 1...Printed wiring board, 4, 5, 7, 8, 9, 10
...Electronic component, 6...groove, 11...recess.

Claims (1)

【実用新案登録請求の範囲】 電子部品4,5が位置決め実装される印刷配線
板の電子部品取付け構造において、 電子部品位置決め凹部6が印刷配線板1に形成
されていることを特徴とする印刷配線板の電子部
品取付け構造。
[Claims for Utility Model Registration] An electronic component mounting structure for a printed wiring board on which electronic components 4 and 5 are positioned and mounted, characterized in that an electronic component positioning recess 6 is formed in the printed wiring board 1. Board electronic component mounting structure.
JP6883787U 1987-05-11 1987-05-11 Pending JPS63178374U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6883787U JPS63178374U (en) 1987-05-11 1987-05-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6883787U JPS63178374U (en) 1987-05-11 1987-05-11

Publications (1)

Publication Number Publication Date
JPS63178374U true JPS63178374U (en) 1988-11-18

Family

ID=30909020

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6883787U Pending JPS63178374U (en) 1987-05-11 1987-05-11

Country Status (1)

Country Link
JP (1) JPS63178374U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103964A (en) * 2006-12-11 2007-04-19 Kyocera Corp Multilayer wiring board with built-in capacitor element and electronic device
JP2016151666A (en) * 2015-02-17 2016-08-22 キヤノン株式会社 Scanning optical device
US10281834B2 (en) 2015-02-17 2019-05-07 Canon Kabushiki Kaisha Optical scanning device
JP2019139249A (en) * 2019-05-07 2019-08-22 キヤノン株式会社 Scanning optical device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103964A (en) * 2006-12-11 2007-04-19 Kyocera Corp Multilayer wiring board with built-in capacitor element and electronic device
JP4511511B2 (en) * 2006-12-11 2010-07-28 京セラ株式会社 Manufacturing method of multilayer wiring board with built-in capacitor element
JP2016151666A (en) * 2015-02-17 2016-08-22 キヤノン株式会社 Scanning optical device
US10281834B2 (en) 2015-02-17 2019-05-07 Canon Kabushiki Kaisha Optical scanning device
JP2019139249A (en) * 2019-05-07 2019-08-22 キヤノン株式会社 Scanning optical device

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