JPS6443577U - - Google Patents
Info
- Publication number
- JPS6443577U JPS6443577U JP13833687U JP13833687U JPS6443577U JP S6443577 U JPS6443577 U JP S6443577U JP 13833687 U JP13833687 U JP 13833687U JP 13833687 U JP13833687 U JP 13833687U JP S6443577 U JPS6443577 U JP S6443577U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- mounting
- dual
- package type
- inline package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
- Multi-Conductor Connections (AREA)
Description
第1図aは本考案の一実施例の斜視図、第1図
bは本実施例のプリント基板への実装状態を示す
斜視図、第1図cは本実施例を実装するプリント
基板の斜視図、第2図aは従来のICソケツトの
一例を示す斜視図、第2図bは従来例のプリント
基板への実装状態を示す斜視図、第2図cは従来
例を実装するプリント基板の斜視図である。
1,6……ソケツト本体、2,7……リード、
3,10……DIPIC、4,8……プリント基
板、5……銅箔部、9……スルーホール。
FIG. 1a is a perspective view of an embodiment of the present invention, FIG. 1b is a perspective view showing how this embodiment is mounted on a printed circuit board, and FIG. 1c is a perspective view of a printed circuit board on which this embodiment is mounted. Fig. 2a is a perspective view showing an example of a conventional IC socket, Fig. 2b is a perspective view showing a state in which the conventional IC socket is mounted on a printed circuit board, and Fig. 2c is a perspective view of a printed circuit board on which the conventional IC socket is mounted. FIG. 1, 6...Socket body, 2, 7...Lead,
3, 10...DIPIC, 4, 8...Printed circuit board, 5...Copper foil section, 9...Through hole.
Claims (1)
接続穴を有するツケツト本体と、該ソケツト本体
の側面に設けられ前記デユアルインラインパツケ
ージ形ICの装着方向に対し直角方向に突出した
リードとを備えることを特徴とするICソケツト
。 The socket is characterized by comprising a socket body having a connection hole for mounting and mounting a dual-inline package type IC, and a lead provided on the side surface of the socket body and protruding in a direction perpendicular to the mounting direction of the dual-inline package type IC. IC socket.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13833687U JPS6443577U (en) | 1987-09-09 | 1987-09-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13833687U JPS6443577U (en) | 1987-09-09 | 1987-09-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6443577U true JPS6443577U (en) | 1989-03-15 |
Family
ID=31400576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13833687U Pending JPS6443577U (en) | 1987-09-09 | 1987-09-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6443577U (en) |
-
1987
- 1987-09-09 JP JP13833687U patent/JPS6443577U/ja active Pending