JPS62112178U - - Google Patents
Info
- Publication number
- JPS62112178U JPS62112178U JP20365185U JP20365185U JPS62112178U JP S62112178 U JPS62112178 U JP S62112178U JP 20365185 U JP20365185 U JP 20365185U JP 20365185 U JP20365185 U JP 20365185U JP S62112178 U JPS62112178 U JP S62112178U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- recess
- pads
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例にかかる印刷配線板
の構造を示す斜視図、第２図は内層配線を有する
多層構造の印刷配線板に本考案を実施した場合の
一例を示す斜視図、第３図はフラツトパツケージ
ＩＣを搭載した従来の印刷配線板を示す斜視図、
第４図はそのパツド部の断面図である。
１……印刷配線板、２，２′……パツド、３…
…ＦＰＩＣ、４……リード、５……凹部、６……
はんだ、７……内層配線。
FIG. 1 is a perspective view showing the structure of a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a perspective view showing an example of the present invention applied to a multilayer printed wiring board having inner layer wiring. Figure 3 is a perspective view showing a conventional printed wiring board equipped with a flat package IC;
FIG. 4 is a sectional view of the pad portion. 1...Printed wiring board, 2,2'...Pad, 3...
...FPIC, 4...Lead, 5...Recess, 6...
Solder, 7...Inner layer wiring.
Claims (1)
ツドを基板表面に形成してなる印刷配線板におい
て、前記パツドの一部に前記基板を貫通しない深
さでかつ前記フラツトパツケージの搭載時に前記
リードが係合可能な凹部を形成したことを特徴と
する印刷配線板。 ２ 前記凹部の深さを多層構造を有する印刷配線
板にあつては内層配線に達する深さとし、前記凹
部の内壁面にメツキ層を形成し、このメツキ層に
より前記内層配線との間で電気接続したことを特
徴とする実用新案登録請求の範囲第１項記載の印
刷配線板。[Claims for Utility Model Registration] 1. A printed wiring board in which pads to which leads of a flat package are connected are formed on the surface of the board, in which part of the pads has a depth that does not penetrate the board and the pads are connected to the flat package. A printed wiring board characterized in that a recess is formed in which the lead can engage when a package is mounted. 2. In the case of a printed wiring board having a multilayer structure, the depth of the recess is set to a depth that reaches the inner layer wiring, a plating layer is formed on the inner wall surface of the recess, and electrical connection is established between the inner layer wiring and the inner layer wiring by this plating layer. A printed wiring board according to claim 1 of the utility model registration claim, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20365185U JPS62112178U (en) | 1985-12-28 | 1985-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20365185U JPS62112178U (en) | 1985-12-28 | 1985-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62112178U true JPS62112178U (en) | 1987-07-17 |
Family
ID=31169179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20365185U Pending JPS62112178U (en) | 1985-12-28 | 1985-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62112178U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022014489A (en) * | 2020-07-07 | 2022-01-20 | 三菱電機株式会社 | On-vehicle electronic control device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60109295A (en) * | 1983-11-18 | 1985-06-14 | 株式会社日立製作所 | Mounting substrate and mounting unit using same |
| JPS61160992A (en) * | 1985-01-09 | 1986-07-21 | 松下電器産業株式会社 | Printed wiring board |
-
1985
- 1985-12-28 JP JP20365185U patent/JPS62112178U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60109295A (en) * | 1983-11-18 | 1985-06-14 | 株式会社日立製作所 | Mounting substrate and mounting unit using same |
| JPS61160992A (en) * | 1985-01-09 | 1986-07-21 | 松下電器産業株式会社 | Printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022014489A (en) * | 2020-07-07 | 2022-01-20 | 三菱電機株式会社 | On-vehicle electronic control device |