JPH0211375U - - Google Patents
Info
- Publication number
- JPH0211375U JPH0211375U JP9078288U JP9078288U JPH0211375U JP H0211375 U JPH0211375 U JP H0211375U JP 9078288 U JP9078288 U JP 9078288U JP 9078288 U JP9078288 U JP 9078288U JP H0211375 U JPH0211375 U JP H0211375U
- Authority
- JP
- Japan
- Prior art keywords
- lsi package
- package
- mounting structure
- leads
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001154 acute effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の側面図、第２図は
第１図に示すＬＳＩパツケージ３の側面図、第３
図は第１図に示すプリント基板１の断面図、第４
図はＬＳＩパツケージとプリント基板の全体構造
を示す斜視図、第５図は従来のＬＳＩパツケージ
と実装構造の側面図である。
１……プリント基板、２，２′……パツド、２
−１……第１次電気銅メツキ、２−２……第２次
電気銅メツキ、３……ＬＳＩパツケージ、４……
パツケージ基板、５，５′……リード、６……ハ
ンダ、ａ……プリント基板の反り。
FIG. 1 is a side view of one embodiment of the present invention, FIG. 2 is a side view of the LSI package 3 shown in FIG.
The figure is a cross-sectional view of the printed circuit board 1 shown in FIG.
The figure is a perspective view showing the overall structure of an LSI package and a printed circuit board, and FIG. 5 is a side view of a conventional LSI package and mounting structure. 1...Printed circuit board, 2, 2'...pad, 2
-1...First electrolytic copper plating, 2-2...Second electrolytic copper plating, 3...LSI package, 4...
Package board, 5, 5'...Lead, 6...Solder, a...Warpage of printed circuit board.
Claims (1)
たリードを、プリント基板上に配置されたパツド
に突き当てて、ハンダ付け接続するＬＳＩパツケ
ージの実装構造において、前記リードの先端を針
状に鋭角に形成し、前記パツドを厚く形成したこ
とを特徴とするＬＳＩパツケージの実装構造。 In an LSI package mounting structure in which leads protruding from a package board of an LSI package are butted against pads arranged on a printed circuit board and connected by soldering, the tips of the leads are formed into needle-like acute angles, and A mounting structure of an LSI package characterized by having a thick layer of .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9078288U JPH0625983Y2 (en) | 1988-07-07 | 1988-07-07 | LSI package mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9078288U JPH0625983Y2 (en) | 1988-07-07 | 1988-07-07 | LSI package mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0211375U true JPH0211375U (en) | 1990-01-24 |
| JPH0625983Y2 JPH0625983Y2 (en) | 1994-07-06 |
Family
ID=31315294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9078288U Expired - Lifetime JPH0625983Y2 (en) | 1988-07-07 | 1988-07-07 | LSI package mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625983Y2 (en) |
-
1988
- 1988-07-07 JP JP9078288U patent/JPH0625983Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0625983Y2 (en) | 1994-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6389251U (en) | ||
| JPH0211375U (en) | ||
| JPS6338368U (en) | ||
| JPS62112178U (en) | ||
| JPS6413152U (en) | ||
| JPH0262769U (en) | ||
| JPH0262772U (en) | ||
| JPS6247171U (en) | ||
| JPS62140775U (en) | ||
| JPH0221754U (en) | ||
| JPH0286175U (en) | ||
| JPH0426520U (en) | ||
| JPH0289870U (en) | ||
| JPS63132476U (en) | ||
| JPH02131675U (en) | ||
| JPH0286174U (en) | ||
| JPH0385682U (en) | ||
| JPS6120069U (en) | Printed board | |
| JPS61153373U (en) | ||
| JPH0167725U (en) | ||
| JPS62135443U (en) | ||
| JPH0459179U (en) | ||
| JPS60121601U (en) | chip parts | |
| JPH0281026U (en) | ||
| JPS60133668U (en) | printed circuit board |