JPH0167725U - - Google Patents
Info
- Publication number
- JPH0167725U JPH0167725U JP1987163851U JP16385187U JPH0167725U JP H0167725 U JPH0167725 U JP H0167725U JP 1987163851 U JP1987163851 U JP 1987163851U JP 16385187 U JP16385187 U JP 16385187U JP H0167725 U JPH0167725 U JP H0167725U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- flux
- utility
- attached
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000004907 flux Effects 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第1図は本考案の一実施例を基板上に配置した
状態を示す斜視図、第2図は本考案の他の実施例
を基板上に配置した状態の側面図、第3図a,b
および第4図a,bは従来のチツプコンデンサを
基板に半田付けする一例および他の例を説明する
ための側面図である。
1……チツプコンデンサ、2……電極、3……
フラツクス、4……半田、5……基板、6……半
田コート、7……導体パツド、8……半田ペース
ト、11……チツプ部品。
Fig. 1 is a perspective view showing one embodiment of the present invention arranged on a board, Fig. 2 is a side view of another embodiment of the invention arranged on a board, and Figs. 3 a and b.
4a and 4b are side views for explaining one example and another example of soldering a conventional chip capacitor to a board. 1... Chip capacitor, 2... Electrode, 3...
flux, 4...solder, 5...board, 6...solder coat, 7...conductor pad, 8...solder paste, 11...chip parts.
Claims (1)
を有することを特徴とする電子回路用チツプ部品
。 A chip component for an electronic circuit characterized by having two electrode parts to which solder and flux are attached.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987163851U JPH0167725U (en) | 1987-10-26 | 1987-10-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987163851U JPH0167725U (en) | 1987-10-26 | 1987-10-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0167725U true JPH0167725U (en) | 1989-05-01 |
Family
ID=31448949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987163851U Pending JPH0167725U (en) | 1987-10-26 | 1987-10-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0167725U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05258986A (en) * | 1992-03-13 | 1993-10-08 | Hitachi Ltd | Electronic component provided with solder chip, device and method of providing solder chip to component lead |
-
1987
- 1987-10-26 JP JP1987163851U patent/JPH0167725U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05258986A (en) * | 1992-03-13 | 1993-10-08 | Hitachi Ltd | Electronic component provided with solder chip, device and method of providing solder chip to component lead |