JPS61149342U

JPS61149342U -

Info

Publication number: JPS61149342U
Application number: JP3191385U
Authority: JP
Priority date: 1985-03-06
Filing date: 1985-03-06
Publication date: 1986-09-16

Description

[Brief explanation of the drawing]

第１図〜第４図はこの考案の一実施例を示し、
第１図は斜視図、第２図は断面図、第３図は組立
図、第４図、第５図は従来装置の一例を示し、第
４図は斜視図、第５図は断面図である。図において１はプリント基板、２，６，１３ａ
〜１３ｃはパターン電極、３はパツケージ、４は
基板、５は回路パターン、７は内部電極、８はワ
イヤ、９は外部リード、１０，１５ａ，１５ｂは
半田、１１は接着剤、１２はランドパターン、１
４ａ，１４ｂはスルーホールである。なお、図中
同一符号は同一または相当部分を示す。 Figures 1 to 4 show an embodiment of this invention,
Fig. 1 is a perspective view, Fig. 2 is a sectional view, Fig. 3 is an assembled view, Figs. 4 and 5 show an example of a conventional device, Fig. 4 is a perspective view, and Fig. 5 is a sectional view. be. In the figure, 1 is a printed circuit board, 2, 6, 13a
~13c is a pattern electrode, 3 is a package, 4 is a substrate, 5 is a circuit pattern, 7 is an internal electrode, 8 is a wire, 9 is an external lead, 10, 15a, 15b is solder, 11 is an adhesive, 12 is a land pattern ,1
4a and 14b are through holes. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims

[Scope of utility model registration request]

A ceramic package for a hybrid integrated circuit having pattern electrodes on an inner bottom surface and an outer bottom surface, and a through hole connecting the pattern electrodes on the inner bottom surface and the pattern electrodes on the outer bottom surface, and a circuit pattern formed on one surface, a hybrid integrated circuit board having, on the other side, a pattern electrode at a position corresponding to the pattern electrode on the inside bottom surface of the package, and the pattern electrode on the inside bottom surface of the package and the pattern electrode of the substrate are soldered. A hybrid integrated circuit device characterized in that the pattern electrodes on the outer bottom surface of the package and the pattern electrodes of a printed circuit board to which the hybrid integrated circuit is attached are connected and fixed by soldering.