JPS62112179U - - Google Patents
Info
- Publication number
- JPS62112179U JPS62112179U JP19086U JP19086U JPS62112179U JP S62112179 U JPS62112179 U JP S62112179U JP 19086 U JP19086 U JP 19086U JP 19086 U JP19086 U JP 19086U JP S62112179 U JPS62112179 U JP S62112179U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- view
- square chip
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 2
Description
第１図は本考案に係る印刷配線板の一実施例に
角型チツプ部品を実装した状態を示す斜視図、第
２図は第１図の部分拡大図、第３図乃至第６図は
本考案の他の実施例を示す斜視図、第７図は従来
の印刷配線板を示す斜視図、第８図及び第９図は
従来の印刷配線板における半田ブリツジの発生状
態を示すそれぞれ平面図及び側面図、第１０図及
び第１１図は従来の印刷配線板における半田過多
の発生状態を示すそれぞれ平面図及び側面図であ
る。
１……印刷配線板、２……角型チツプ部品、３
……電極、４，７，９，１０，１１，１２……ラ
ンド、５，６……半田。
Fig. 1 is a perspective view showing a state in which square chip components are mounted on an embodiment of the printed wiring board according to the present invention, Fig. 2 is a partially enlarged view of Fig. 1, and Figs. FIG. 7 is a perspective view showing another embodiment of the invention; FIG. 7 is a perspective view showing a conventional printed wiring board; FIGS. The side view, FIG. 10, and FIG. 11 are a plan view and a side view, respectively, showing how excessive solder occurs in a conventional printed wiring board. 1...Printed wiring board, 2...Square chip parts, 3
...Electrode, 4,7,9,10,11,12...Land, 5,6...Solder.
Claims (1)
るために印刷配線板上に形成されたランドの中央
部を凹状に形成したことを特徴とする印刷配線板
。 A printed wiring board characterized in that a land formed on the printed wiring board has a concave central part for mounting electrodes of a square chip component by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19086U JPS62112179U (en) | 1986-01-07 | 1986-01-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19086U JPS62112179U (en) | 1986-01-07 | 1986-01-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62112179U true JPS62112179U (en) | 1987-07-17 |
Family
ID=30776946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19086U Pending JPS62112179U (en) | 1986-01-07 | 1986-01-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62112179U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001097580A1 (en) * | 2000-06-12 | 2001-12-20 | Hitachi, Ltd. | Electronic device and method of manufacturing the electronic device |
| JP2010109535A (en) * | 2008-10-29 | 2010-05-13 | Nippon Dempa Kogyo Co Ltd | Method of mounting surface mounting crystal oscillator onto set substrate |
| JP2015039113A (en) * | 2013-08-19 | 2015-02-26 | 株式会社村田製作所 | Component module |
| JP2015039028A (en) * | 2008-06-18 | 2015-02-26 | 株式会社半導体エネルギー研究所 | Mounting structure and printed circuit board |
| JP2016086066A (en) * | 2014-10-24 | 2016-05-19 | 株式会社村田製作所 | Electronic component, circuit module and circuit board |
| JP2018022793A (en) * | 2016-08-04 | 2018-02-08 | パナソニックＩｐマネジメント株式会社 | Electronic component and electronic apparatus using the same |
-
1986
- 1986-01-07 JP JP19086U patent/JPS62112179U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001097580A1 (en) * | 2000-06-12 | 2001-12-20 | Hitachi, Ltd. | Electronic device and method of manufacturing the electronic device |
| JP2015039028A (en) * | 2008-06-18 | 2015-02-26 | 株式会社半導体エネルギー研究所 | Mounting structure and printed circuit board |
| US9095066B2 (en) | 2008-06-18 | 2015-07-28 | Semiconductor Energy Laboratory Co., Ltd. | Printed board |
| JP2010109535A (en) * | 2008-10-29 | 2010-05-13 | Nippon Dempa Kogyo Co Ltd | Method of mounting surface mounting crystal oscillator onto set substrate |
| JP2015039113A (en) * | 2013-08-19 | 2015-02-26 | 株式会社村田製作所 | Component module |
| JP2016086066A (en) * | 2014-10-24 | 2016-05-19 | 株式会社村田製作所 | Electronic component, circuit module and circuit board |
| JP2018022793A (en) * | 2016-08-04 | 2018-02-08 | パナソニックＩｐマネジメント株式会社 | Electronic component and electronic apparatus using the same |