JPH0165175U - - Google Patents
Info
- Publication number
- JPH0165175U JPH0165175U JP1987161037U JP16103787U JPH0165175U JP H0165175 U JPH0165175 U JP H0165175U JP 1987161037 U JP1987161037 U JP 1987161037U JP 16103787 U JP16103787 U JP 16103787U JP H0165175 U JPH0165175 U JP H0165175U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- circuit component
- recess
- washer
- mounting washer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013013 elastic material Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の取付座金の平面図、第２図は
縦断面図、第３図は従来の取付座金の平面図、第
４図は縦断面図である。
１……取付座金、２……凹み、３……取付穴、
４……回路部品、５……リード線、６……プリン
ト基板、７……回路部品取付穴、８……ランドパ
ターン、９……リード線ハンダ付け、１０……取
付座金ハンダ付け。
FIG. 1 is a plan view of the mounting washer of the present invention, FIG. 2 is a longitudinal sectional view, FIG. 3 is a plan view of a conventional mounting washer, and FIG. 4 is a longitudinal sectional view. 1...Mounting washer, 2...Dent, 3...Mounting hole,
4... Circuit component, 5... Lead wire, 6... Printed circuit board, 7... Circuit component mounting hole, 8... Land pattern, 9... Lead wire soldering, 10... Mounting washer soldering.
Claims (1)
みを設け、その凹みの中心に回路部品取付用の穴
を有し、回路部品の取付位置決め機能を持つこと
を特徴とするプリント基板用の貫通型回路部品取
付座金。 A through-type circuit component for a printed circuit board, characterized in that the structure of the mounting washer includes a recess formed in an elastic material, a hole for mounting a circuit component in the center of the recess, and a function for positioning the mounting of the circuit component. Mounting washer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161037U JPH0514549Y2 (en) | 1987-10-20 | 1987-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161037U JPH0514549Y2 (en) | 1987-10-20 | 1987-10-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0165175U true JPH0165175U (en) | 1989-04-26 |
| JPH0514549Y2 JPH0514549Y2 (en) | 1993-04-19 |
Family
ID=31443632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161037U Expired - Lifetime JPH0514549Y2 (en) | 1987-10-20 | 1987-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514549Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827866B2 (en) * | 1976-06-19 | 1983-06-11 | 新日本製鐵株式会社 | Method and device for determining hydrogen in metals |
-
1987
- 1987-10-20 JP JP1987161037U patent/JPH0514549Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514549Y2 (en) | 1993-04-19 |