JPS63118262U - - Google Patents
Info
- Publication number
- JPS63118262U JPS63118262U JP884887U JP884887U JPS63118262U JP S63118262 U JPS63118262 U JP S63118262U JP 884887 U JP884887 U JP 884887U JP 884887 U JP884887 U JP 884887U JP S63118262 U JPS63118262 U JP S63118262U
- Authority
- JP
- Japan
- Prior art keywords
- component mounting
- circuit board
- chip component
- view
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Resistors (AREA)
Description
第１図は本考案によりチツプ部品を回路基板に
ハンダ付け接続した一実施例を示す平面図。第２
図は第１図の側面図、第３図は第２図の回路基板
に反りを生じた状態の側面図。第４図、第６図は
本考案による他の実施例を示す平面図、第５図、
第７図は第４図、第６図の側面図。第８図は従来
の平面図、第９図は第８図の側面図、第１０図は
第９図の回路基板に反りを生じた状態を示す側面
図である。
１……チツプ部品、２ａ，２ｂ……チツプ部品
の電極、３ａ，３ｂ……配線パターン、４ａ，４
ｂ……取付パターン、５ａ，５ｂ，１５ａ，１５
ｂ，２５ａ，２５ｂ……伸縮する構造をなす電極
板、６，６′……ハンダ、７……回路基板。
FIG. 1 is a plan view showing an embodiment in which chip components are soldered and connected to a circuit board according to the present invention. Second
The figure is a side view of FIG. 1, and FIG. 3 is a side view of the circuit board of FIG. 2 in a warped state. 4 and 6 are plan views showing other embodiments of the present invention; FIG. 5;
FIG. 7 is a side view of FIGS. 4 and 6. 8 is a conventional plan view, FIG. 9 is a side view of FIG. 8, and FIG. 10 is a side view of the circuit board of FIG. 9 in a warped state. 1... Chip parts, 2a, 2b... Electrodes of chip parts, 3a, 3b... Wiring patterns, 4a, 4
b...Mounting pattern, 5a, 5b, 15a, 15
b, 25a, 25b...Electrode plate having an expandable structure, 6, 6'...Solder, 7...Circuit board.
Claims (1)
電極とを伸縮する構造をなす電極板を介し電気的
に接続したことを特徴とするチツプ部品の取付構
造。 A chip component mounting structure characterized in that a component mounting pattern on a circuit board and an electrode of the chip component are electrically connected via an electrode plate having an expandable structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP884887U JPS63118262U (en) | 1987-01-23 | 1987-01-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP884887U JPS63118262U (en) | 1987-01-23 | 1987-01-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63118262U true JPS63118262U (en) | 1988-07-30 |
Family
ID=30793611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP884887U Pending JPS63118262U (en) | 1987-01-23 | 1987-01-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63118262U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57181144A (en) * | 1981-05-01 | 1982-11-08 | Toshiba Corp | Semiconductor device |
| JPS5922386A (en) * | 1982-07-07 | 1984-02-04 | アルカテル・エヌ・ブイ | Electronic part structure |
-
1987
- 1987-01-23 JP JP884887U patent/JPS63118262U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57181144A (en) * | 1981-05-01 | 1982-11-08 | Toshiba Corp | Semiconductor device |
| JPS5922386A (en) * | 1982-07-07 | 1984-02-04 | アルカテル・エヌ・ブイ | Electronic part structure |