JPH01139480U - - Google Patents

Info

Publication number
JPH01139480U
JPH01139480U JP3450588U JP3450588U JPH01139480U JP H01139480 U JPH01139480 U JP H01139480U JP 3450588 U JP3450588 U JP 3450588U JP 3450588 U JP3450588 U JP 3450588U JP H01139480 U JPH01139480 U JP H01139480U
Authority
JP
Japan
Prior art keywords
chip component
mounting structure
chip
component mounting
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3450588U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3450588U priority Critical patent/JPH01139480U/ja
Publication of JPH01139480U publication Critical patent/JPH01139480U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例のチツプ部品の装着
構造を示す側断面図、第2図は第1図に係るチツ
プ部品装着状態の平面図、第3図は従来のチツプ
部品装着状態の平面図、第4図は第3図における
要部の側断面図である。 1……チツプ部品、2……プリント基板、3…
…電極パターン。
FIG. 1 is a side sectional view showing a chip component mounting structure according to an embodiment of the present invention, FIG. 2 is a plan view of the chip component mounted state according to FIG. 1, and FIG. 3 is a plan view of a conventional chip component mounted state. The plan view and FIG. 4 are side sectional views of the main parts in FIG. 3. 1...Chip parts, 2...Printed circuit board, 3...
...electrode pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板上の同一の電極パターン間に複数
のチツプ部品を装着するチツプ部品の装着構造に
おいて、チツプ部品を装着した上にさらに他のチ
ツプ部品を重ねて装着したことを特徴とするチツ
プ部品の装着構造。
In a chip component mounting structure in which a plurality of chip components are mounted between the same electrode patterns on a printed circuit board, a chip component mounting structure is characterized in that a chip component is mounted and then another chip component is mounted in a layered manner. structure.
JP3450588U 1988-03-17 1988-03-17 Pending JPH01139480U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3450588U JPH01139480U (en) 1988-03-17 1988-03-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3450588U JPH01139480U (en) 1988-03-17 1988-03-17

Publications (1)

Publication Number Publication Date
JPH01139480U true JPH01139480U (en) 1989-09-22

Family

ID=31261212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3450588U Pending JPH01139480U (en) 1988-03-17 1988-03-17

Country Status (1)

Country Link
JP (1) JPH01139480U (en)

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