JPH02120866U - - Google Patents
Info
- Publication number
- JPH02120866U JPH02120866U JP2919589U JP2919589U JPH02120866U JP H02120866 U JPH02120866 U JP H02120866U JP 2919589 U JP2919589 U JP 2919589U JP 2919589 U JP2919589 U JP 2919589U JP H02120866 U JPH02120866 U JP H02120866U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- electrode
- pattern
- soldered
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000926 separation method Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の実施例の構成図で、ａは平面
図、ｂは側断面図、第２図は従来例の構成図で、
ａは平面図、ｂは側断面図である。
図において、１はパツド、２は細幅パターン、
５はチツプ部品、６Ａ，６Ｂは電極、７は回路基
板、８は溶融半田、１０は分離パツド、１１は広
面積パターン、１５はパターンをそれぞれ示す。
Fig. 1 is a block diagram of an embodiment of the present invention, a is a plan view, b is a side sectional view, and Fig. 2 is a block diagram of a conventional example.
A is a plan view, and b is a side sectional view. In the figure, 1 is padded, 2 is narrow pattern,
5 is a chip component, 6A and 6B are electrodes, 7 is a circuit board, 8 is molten solder, 10 is a separation pad, 11 is a wide area pattern, and 15 is a pattern.
Claims (1)
ド１に、他方の電極６Ｂを広面積パターン１１内
の所定の位置に、それぞれ半田付けして、チツプ
部品５を回路基板７に表面実装する回路基板装置
において、 他方の該電極６Ｂに対応する該広面積パターン
１１の領域内に、前記パツド１と同形状の分離パ
ツド１０が設けられ、該分離パツド１０と該広面
積パターン１１とが、所望数の細幅のパターン１
５で接続されてなることを特徴とする回路基板装
置のパツド構造。[Claims for Utility Model Registration] One electrode 6A is soldered to the pad 1 connected to the narrow pattern 2, and the other electrode 6B is soldered to a predetermined position within the wide area pattern 11, thereby forming the chip component 5 into a circuit. In a circuit board device that is surface mounted on a substrate 7, a separation pad 10 having the same shape as the pad 1 is provided in the area of the wide area pattern 11 corresponding to the other electrode 6B, and a separation pad 10 having the same shape as the pad 1 is provided. The area pattern 11 is a desired number of narrow patterns 1.
A pad structure of a circuit board device characterized by being connected by 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2919589U JPH02120866U (en) | 1989-03-15 | 1989-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2919589U JPH02120866U (en) | 1989-03-15 | 1989-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02120866U true JPH02120866U (en) | 1990-09-28 |
Family
ID=31253195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2919589U Pending JPH02120866U (en) | 1989-03-15 | 1989-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02120866U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002305370A (en) * | 2001-04-06 | 2002-10-18 | Sanken Electric Co Ltd | Circuit board, electronic component mounter, and manufacturing method thereof |
| JP2008218644A (en) * | 2007-03-02 | 2008-09-18 | Sumitomo Wiring Syst Ltd | Circuit board and circuit board with electronic component |
| JP2011100987A (en) * | 2009-10-07 | 2011-05-19 | Renesas Electronics Corp | Wiring board |
| JP2017084902A (en) * | 2015-10-26 | 2017-05-18 | パナソニックＩｐマネジメント株式会社 | Mounting board nad electronic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858379B2 (en) * | 1975-07-14 | 1983-12-24 | 旭化成株式会社 | Flame retardant polyester composition |
-
1989
- 1989-03-15 JP JP2919589U patent/JPH02120866U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5858379B2 (en) * | 1975-07-14 | 1983-12-24 | 旭化成株式会社 | Flame retardant polyester composition |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002305370A (en) * | 2001-04-06 | 2002-10-18 | Sanken Electric Co Ltd | Circuit board, electronic component mounter, and manufacturing method thereof |
| JP2008218644A (en) * | 2007-03-02 | 2008-09-18 | Sumitomo Wiring Syst Ltd | Circuit board and circuit board with electronic component |
| JP2011100987A (en) * | 2009-10-07 | 2011-05-19 | Renesas Electronics Corp | Wiring board |
| JP2017084902A (en) * | 2015-10-26 | 2017-05-18 | パナソニックＩｐマネジメント株式会社 | Mounting board nad electronic device |