JPH0286174U - - Google Patents
Info
- Publication number
- JPH0286174U JPH0286174U JP16639288U JP16639288U JPH0286174U JP H0286174 U JPH0286174 U JP H0286174U JP 16639288 U JP16639288 U JP 16639288U JP 16639288 U JP16639288 U JP 16639288U JP H0286174 U JPH0286174 U JP H0286174U
- Authority
- JP
- Japan
- Prior art keywords
- dummy
- wiring board
- printed wiring
- pad
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の実施例の平面図、第２図は本
考案の他の実施例の平面図、第３図は従来例の斜
視図、第４図は従来例の平面図である。
図において、１は半導体部品、２はリード、２
ｄはダミーリード、５は印刷配線板、６はパツド
、６ｄはダミーパツド、１０はパターン、Ｐは半
田ブリツジをそれぞれ示す。
FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a plan view of another embodiment of the present invention, FIG. 3 is a perspective view of a conventional example, and FIG. 4 is a plan view of a conventional example. In the figure, 1 is a semiconductor component, 2 is a lead, 2
d is a dummy lead, 5 is a printed wiring board, 6 is a pad, 6d is a dummy pad, 10 is a pattern, and P is a solder bridge.
Claims (1)
面実装する印刷配線板５において、 該印刷配線板５にリード２を半田付けするパツ
ド６と、該ダミーリード２ｄを半田付けするダミ
ーパツド６ｄとを配列し、 該ダミーパツド６ｄ相互間を、パターン１０で
連結したことを特徴とする印刷配線板のパツド構
造。[Claims for Utility Model Registration] In a printed wiring board 5 on which a semiconductor component 1 having dummy leads 2d is surface mounted, a pad 6 for soldering the leads 2 to the printed wiring board 5 and a pad 6 for soldering the dummy leads 2d. A pad structure for a printed wiring board, characterized in that dummy pads 6d are arranged, and the dummy pads 6d are connected by a pattern 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16639288U JPH0286174U (en) | 1988-12-20 | 1988-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16639288U JPH0286174U (en) | 1988-12-20 | 1988-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0286174U true JPH0286174U (en) | 1990-07-09 |
Family
ID=31453729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16639288U Pending JPH0286174U (en) | 1988-12-20 | 1988-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0286174U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008004288A1 (en) * | 2006-07-05 | 2008-01-10 | Fujitsu Limited | Printed wiring board and electronic device |
-
1988
- 1988-12-20 JP JP16639288U patent/JPH0286174U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008004288A1 (en) * | 2006-07-05 | 2008-01-10 | Fujitsu Limited | Printed wiring board and electronic device |