JPH0213772U - - Google Patents
Info
- Publication number
- JPH0213772U JPH0213772U JP9194988U JP9194988U JPH0213772U JP H0213772 U JPH0213772 U JP H0213772U JP 9194988 U JP9194988 U JP 9194988U JP 9194988 U JP9194988 U JP 9194988U JP H0213772 U JPH0213772 U JP H0213772U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- lead
- view
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係るプリント配線板の一実施
例の要部を示す斜視図、第２図は第１図の正面図
、第３図は本考案の他の実施例の要部を示す斜視
図、第４図は第３図の正面図、第５図、第９図、
第１２図はそれぞれ基板に実装される電子部品を
示す平面図、第６図、第１０図、第１３図はそれ
ぞれ第５図、第９図、第１２図に示す電子部品を
基板に実装する方式を示す断面図、第７図、第８
図はそれぞれ第６図の要部を示す拡大断面図、第
１１図、第１４図はそれぞれ第１０図、第１３図
の要部を示す拡大断面図、第１５図、第１６図は
それぞれリードをパツドから取り外す手段を示す
斜視図である。
２……基板（プリント配線板）、３……パツド
、５，９……リード、８……フラツトパツケージ
ＩＣ（電子部品）、３ａ，３ｂ……凹部。
Fig. 1 is a perspective view showing the main parts of one embodiment of the printed wiring board according to the present invention, Fig. 2 is a front view of Fig. 1, and Fig. 3 shows the main parts of another embodiment of the invention. A perspective view, FIG. 4 is a front view of FIG. 3, FIG. 5, FIG. 9,
Fig. 12 is a plan view showing the electronic components mounted on the board, and Figs. 6, 10, and 13 show the electronic components shown in Figs. 5, 9, and 12, respectively, mounted on the board. Cross-sectional diagrams showing the method, Figures 7 and 8
The figures are enlarged sectional views showing the main parts of Fig. 6, Figs. 11 and 14 are enlarged sectional views showing the main parts of Figs. 10 and 13, respectively, and Figs. 15 and 16 are lead FIG. 3 is a perspective view showing means for removing the pad from the pad. 2... Substrate (printed wiring board), 3... Pad, 5, 9... Lead, 8... Flat package IC (electronic component), 3a, 3b... Recess.
Claims (1)
面に設けられたプリント配線板において、前記パ
ツドの表面の前記リードが当接する半田付け接触
部に凹部を形成したことを特徴とするプリント配
線板。 1. A printed wiring board having a pad on its surface to which a lead of an electronic component is soldered, characterized in that a recess is formed in a soldering contact portion of the surface of the pad where the lead comes into contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9194988U JPH0213772U (en) | 1988-07-13 | 1988-07-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9194988U JPH0213772U (en) | 1988-07-13 | 1988-07-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0213772U true JPH0213772U (en) | 1990-01-29 |
Family
ID=31316406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9194988U Pending JPH0213772U (en) | 1988-07-13 | 1988-07-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0213772U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05172186A (en) * | 1991-05-10 | 1993-07-09 | Bayerische Motoren Werke Ag | Torsional vibration damper for motive power unit gearing |
| JPH09232737A (en) * | 1996-02-28 | 1997-09-05 | Hitachi Aic Inc | Printed-wiring board |
-
1988
- 1988-07-13 JP JP9194988U patent/JPH0213772U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05172186A (en) * | 1991-05-10 | 1993-07-09 | Bayerische Motoren Werke Ag | Torsional vibration damper for motive power unit gearing |
| JPH09232737A (en) * | 1996-02-28 | 1997-09-05 | Hitachi Aic Inc | Printed-wiring board |
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