JPS6138975U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS6138975U
JPS6138975U JP12142684U JP12142684U JPS6138975U JP S6138975 U JPS6138975 U JP S6138975U JP 12142684 U JP12142684 U JP 12142684U JP 12142684 U JP12142684 U JP 12142684U JP S6138975 U JPS6138975 U JP S6138975U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
electrode
chip component
recessed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12142684U
Other languages
Japanese (ja)
Inventor
正幸 加藤
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP12142684U priority Critical patent/JPS6138975U/en
Publication of JPS6138975U publication Critical patent/JPS6138975U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1甲乃至第4図は本考案の印刷配線板を説明する図で
あり、第1図は第1の実施例を説明する平面図、第2図
は印刷配線板に塗布された半田の状態を示す第1図の拡
大断面図、第3図は第2の実施例を説明する平面図、第
4図は第3の実施例を説明する平面図である。 第5図は従来の印刷配線板を説明する斜視図であり、第
6図は印刷配線板に塗布された半田の状態を示す第5図
の拡大断面図である。 IA, IB, IC・・・・・・印刷配線板、4
A,4B,4C・・・・・・接続部、5・・曲チップ部
、6・・間チップ部品の電極、IOA,IOB,12B
,10C・・・・・・パターン部、11A,11B,1
1c・・・・・・凹部、9・・・川クリーム状はんだ、
9A・・曲液化したはんだ。
1A to 4 are diagrams for explaining the printed wiring board of the present invention, FIG. 1 is a plan view for explaining the first embodiment, and FIG. 2 is a state of solder applied to the printed wiring board. FIG. 3 is a plan view for explaining the second embodiment, and FIG. 4 is a plan view for explaining the third embodiment. FIG. 5 is a perspective view illustrating a conventional printed wiring board, and FIG. 6 is an enlarged sectional view of FIG. 5 showing the state of solder applied to the printed wiring board. IA, IB, IC...Printed wiring board, 4
A, 4B, 4C... Connection part, 5... Curved chip part, 6... Electrode of chip parts between, IOA, IOB, 12B
, 10C...pattern part, 11A, 11B, 1
1c...concavity, 9...creamy solder,
9A: Solder that has liquefied.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チップ部品の電極を半田付けするための接続部を有する
印刷配線板において、前記接続部を前記チップ部品の電
極と当接するパターン部と該パターン部より窪んだ凹部
とて構成したことを特徴とする印刷配線板。
A printed wiring board having a connecting portion for soldering an electrode of a chip component, characterized in that the connecting portion is configured with a pattern portion that comes into contact with the electrode of the chip component, and a recessed portion recessed from the pattern portion. Printed wiring board.
JP12142684U 1984-08-09 1984-08-09 printed wiring board Pending JPS6138975U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12142684U JPS6138975U (en) 1984-08-09 1984-08-09 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12142684U JPS6138975U (en) 1984-08-09 1984-08-09 printed wiring board

Publications (1)

Publication Number Publication Date
JPS6138975U true JPS6138975U (en) 1986-03-11

Family

ID=30680211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12142684U Pending JPS6138975U (en) 1984-08-09 1984-08-09 printed wiring board

Country Status (1)

Country Link
JP (1) JPS6138975U (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04273192A (en) * 1991-02-27 1992-09-29 Sharp Corp Terminal connection structure of part
JP2010171441A (en) * 2010-03-17 2010-08-05 Renesas Electronics Corp Electronic circuit board
JP2014003101A (en) * 2012-06-15 2014-01-09 Toshiba Corp Circuit board and electronic apparatus
JP2018082003A (en) * 2016-11-15 2018-05-24 凸版印刷株式会社 Non-contact communication medium
WO2020121851A1 (en) * 2018-12-12 2020-06-18 浜松ホトニクス株式会社 Light detection device
JP2020096157A (en) * 2018-12-12 2020-06-18 浜松ホトニクス株式会社 Light detecting device
US11513002B2 (en) 2018-12-12 2022-11-29 Hamamatsu Photonics K.K. Light detection device having temperature compensated gain in avalanche photodiode
US11901379B2 (en) 2018-12-12 2024-02-13 Hamamatsu Photonics K.K. Photodetector
US12080822B2 (en) 2018-12-12 2024-09-03 Hamamatsu Photonics K.K. Photodetector and method for manufacturing photodetector

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04273192A (en) * 1991-02-27 1992-09-29 Sharp Corp Terminal connection structure of part
JP2010171441A (en) * 2010-03-17 2010-08-05 Renesas Electronics Corp Electronic circuit board
JP2014003101A (en) * 2012-06-15 2014-01-09 Toshiba Corp Circuit board and electronic apparatus
JP2018082003A (en) * 2016-11-15 2018-05-24 凸版印刷株式会社 Non-contact communication medium
WO2020121851A1 (en) * 2018-12-12 2020-06-18 浜松ホトニクス株式会社 Light detection device
JP2020096157A (en) * 2018-12-12 2020-06-18 浜松ホトニクス株式会社 Light detecting device
US11513002B2 (en) 2018-12-12 2022-11-29 Hamamatsu Photonics K.K. Light detection device having temperature compensated gain in avalanche photodiode
US11561131B2 (en) 2018-12-12 2023-01-24 Hamamatsu Photonics K.K. Determination method and light detection device
US11901379B2 (en) 2018-12-12 2024-02-13 Hamamatsu Photonics K.K. Photodetector
US11927478B2 (en) 2018-12-12 2024-03-12 Hamamatsu Photonics K.K. Light detection device
US12080822B2 (en) 2018-12-12 2024-09-03 Hamamatsu Photonics K.K. Photodetector and method for manufacturing photodetector
US12113088B2 (en) 2018-12-12 2024-10-08 Hamamatsu Photonics K.K. Light detection device

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