JPS6138975U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS6138975U JPS6138975U JP12142684U JP12142684U JPS6138975U JP S6138975 U JPS6138975 U JP S6138975U JP 12142684 U JP12142684 U JP 12142684U JP 12142684 U JP12142684 U JP 12142684U JP S6138975 U JPS6138975 U JP S6138975U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- electrode
- chip component
- recessed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1甲乃至第4図は本考案の印刷配線板を説明する図で
あり、第1図は第1の実施例を説明する平面図、第2図
は印刷配線板に塗布された半田の状態を示す第1図の拡
大断面図、第3図は第2の実施例を説明する平面図、第
4図は第3の実施例を説明する平面図である。
第5図は従来の印刷配線板を説明する斜視図であり、第
6図は印刷配線板に塗布された半田の状態を示す第5図
の拡大断面図である。
IA, IB, IC・・・・・・印刷配線板、4
A,4B,4C・・・・・・接続部、5・・曲チップ部
、6・・間チップ部品の電極、IOA,IOB,12B
,10C・・・・・・パターン部、11A,11B,1
1c・・・・・・凹部、9・・・川クリーム状はんだ、
9A・・曲液化したはんだ。1A to 4 are diagrams for explaining the printed wiring board of the present invention, FIG. 1 is a plan view for explaining the first embodiment, and FIG. 2 is a state of solder applied to the printed wiring board. FIG. 3 is a plan view for explaining the second embodiment, and FIG. 4 is a plan view for explaining the third embodiment. FIG. 5 is a perspective view illustrating a conventional printed wiring board, and FIG. 6 is an enlarged sectional view of FIG. 5 showing the state of solder applied to the printed wiring board. IA, IB, IC...Printed wiring board, 4
A, 4B, 4C... Connection part, 5... Curved chip part, 6... Electrode of chip parts between, IOA, IOB, 12B
, 10C...pattern part, 11A, 11B, 1
1c...concavity, 9...creamy solder,
9A: Solder that has liquefied.
Claims (1)
印刷配線板において、前記接続部を前記チップ部品の電
極と当接するパターン部と該パターン部より窪んだ凹部
とて構成したことを特徴とする印刷配線板。A printed wiring board having a connecting portion for soldering an electrode of a chip component, characterized in that the connecting portion is configured with a pattern portion that comes into contact with the electrode of the chip component, and a recessed portion recessed from the pattern portion. Printed wiring board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12142684U JPS6138975U (en) | 1984-08-09 | 1984-08-09 | printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12142684U JPS6138975U (en) | 1984-08-09 | 1984-08-09 | printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6138975U true JPS6138975U (en) | 1986-03-11 |
Family
ID=30680211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12142684U Pending JPS6138975U (en) | 1984-08-09 | 1984-08-09 | printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6138975U (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04273192A (en) * | 1991-02-27 | 1992-09-29 | Sharp Corp | Terminal connection structure of part |
JP2010171441A (en) * | 2010-03-17 | 2010-08-05 | Renesas Electronics Corp | Electronic circuit board |
JP2014003101A (en) * | 2012-06-15 | 2014-01-09 | Toshiba Corp | Circuit board and electronic apparatus |
JP2018082003A (en) * | 2016-11-15 | 2018-05-24 | 凸版印刷株式会社 | Non-contact communication medium |
WO2020121851A1 (en) * | 2018-12-12 | 2020-06-18 | 浜松ホトニクス株式会社 | Light detection device |
JP2020096157A (en) * | 2018-12-12 | 2020-06-18 | 浜松ホトニクス株式会社 | Light detecting device |
US11513002B2 (en) | 2018-12-12 | 2022-11-29 | Hamamatsu Photonics K.K. | Light detection device having temperature compensated gain in avalanche photodiode |
US11901379B2 (en) | 2018-12-12 | 2024-02-13 | Hamamatsu Photonics K.K. | Photodetector |
US12080822B2 (en) | 2018-12-12 | 2024-09-03 | Hamamatsu Photonics K.K. | Photodetector and method for manufacturing photodetector |
-
1984
- 1984-08-09 JP JP12142684U patent/JPS6138975U/en active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04273192A (en) * | 1991-02-27 | 1992-09-29 | Sharp Corp | Terminal connection structure of part |
JP2010171441A (en) * | 2010-03-17 | 2010-08-05 | Renesas Electronics Corp | Electronic circuit board |
JP2014003101A (en) * | 2012-06-15 | 2014-01-09 | Toshiba Corp | Circuit board and electronic apparatus |
JP2018082003A (en) * | 2016-11-15 | 2018-05-24 | 凸版印刷株式会社 | Non-contact communication medium |
WO2020121851A1 (en) * | 2018-12-12 | 2020-06-18 | 浜松ホトニクス株式会社 | Light detection device |
JP2020096157A (en) * | 2018-12-12 | 2020-06-18 | 浜松ホトニクス株式会社 | Light detecting device |
US11513002B2 (en) | 2018-12-12 | 2022-11-29 | Hamamatsu Photonics K.K. | Light detection device having temperature compensated gain in avalanche photodiode |
US11561131B2 (en) | 2018-12-12 | 2023-01-24 | Hamamatsu Photonics K.K. | Determination method and light detection device |
US11901379B2 (en) | 2018-12-12 | 2024-02-13 | Hamamatsu Photonics K.K. | Photodetector |
US11927478B2 (en) | 2018-12-12 | 2024-03-12 | Hamamatsu Photonics K.K. | Light detection device |
US12080822B2 (en) | 2018-12-12 | 2024-09-03 | Hamamatsu Photonics K.K. | Photodetector and method for manufacturing photodetector |
US12113088B2 (en) | 2018-12-12 | 2024-10-08 | Hamamatsu Photonics K.K. | Light detection device |
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