JPS6422074U - - Google Patents
Info
- Publication number
- JPS6422074U JPS6422074U JP11629787U JP11629787U JPS6422074U JP S6422074 U JPS6422074 U JP S6422074U JP 11629787 U JP11629787 U JP 11629787U JP 11629787 U JP11629787 U JP 11629787U JP S6422074 U JPS6422074 U JP S6422074U
- Authority
- JP
- Japan
- Prior art keywords
- land portions
- circuit board
- printed circuit
- mini
- flat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案の一実施例に係わるプリント
基板の構成を示す斜視図、第２図は同実施例にお
ける半田付け処理後の状態を示す側面図、第３図
は従来のプリント基板の構成を示す斜視図、第４
図及び第５図は従来のプリント基板における半田
付け過程を示す側面図である。
２１……プリント基板、２２ａ，２２ｂ，２３
ａ……ランド部、２４……ミニフラツトＩＣ、２
５ａ，２５ｂ，２６ａ，２６ｂ……リード線、２
７……接着剤、２８……つらら状の半田。
Fig. 1 is a perspective view showing the structure of a printed circuit board according to an embodiment of this invention, Fig. 2 is a side view showing the state after soldering in the same embodiment, and Fig. 3 is the structure of a conventional printed circuit board. Perspective view showing 4th
1 and 5 are side views showing the soldering process on a conventional printed circuit board. 21...Printed circuit board, 22a, 22b, 23
a...Land part, 24...Mini flat IC, 2
5a, 25b, 26a, 26b...Lead wire, 2
7...Adhesive, 28...Icicle-shaped solder.
Claims (1)
めの複数のランド部を有するプリント基板におい
て、上記複数のランド部のうち少なくとも一方の
端部に位置する一対のランド部を幅広に形成した
ことを特徴とするプリント基板。 A printed circuit board having a plurality of land portions for soldering lead wires of a mini-flat IC, characterized in that a pair of land portions located at at least one end of the plurality of land portions are formed wide. Printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11629787U JPS6422074U (en) | 1987-07-29 | 1987-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11629787U JPS6422074U (en) | 1987-07-29 | 1987-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6422074U true JPS6422074U (en) | 1989-02-03 |
Family
ID=31358706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11629787U Pending JPS6422074U (en) | 1987-07-29 | 1987-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6422074U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6047494A (en) * | 1983-08-26 | 1985-03-14 | 松下電器産業株式会社 | Method of mounting electric part on printed circuit board |
-
1987
- 1987-07-29 JP JP11629787U patent/JPS6422074U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6047494A (en) * | 1983-08-26 | 1985-03-14 | 松下電器産業株式会社 | Method of mounting electric part on printed circuit board |
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