JPS6338367U - - Google Patents
Info
- Publication number
- JPS6338367U JPS6338367U JP13155686U JP13155686U JPS6338367U JP S6338367 U JPS6338367 U JP S6338367U JP 13155686 U JP13155686 U JP 13155686U JP 13155686 U JP13155686 U JP 13155686U JP S6338367 U JPS6338367 U JP S6338367U
- Authority
- JP
- Japan
- Prior art keywords
- leads
- conductive foil
- lead
- width
- foil portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
Description
第１図は、本考案のプリント配線基板の部分斜
視図及びフラツトパツケージ形ＩＣの斜視図、第
２図は要部の平面図である。
４，４…，４′，４′……リード用導電箔、７
，７……スリツト。
FIG. 1 is a partial perspective view of a printed wiring board and a flat package IC according to the present invention, and FIG. 2 is a plan view of the main parts. 4, 4..., 4', 4'... Conductive foil for leads, 7
,7...slit.
Claims (1)
けするリード用導電箔部を設け、予め該リード用
導電箔部に半田を付着し該半田上に前記ＩＣのリ
ードを載置して一方向から連続的に半田付けする
ものにおいて、前記ＩＣの各辺の両端のリードに
対応するリード用導電箔部の幅を他のリードに対
応するリード用導電箔部の幅より広く形成し、且
つこの幅広のリード用導電箔部に他のリード用導
電箔部と略同一の幅を有しリードを半田付けする
部分を内側に形成するようにスリツトを設けたこ
とを特徴とするプリント配線基板。 A conductive foil part for leads to which a flat package type IC is soldered is provided on an insulating substrate, solder is applied to the conductive foil part for leads in advance, and the leads of the IC are placed on the solder so as to be continuous from one direction. The width of the conductive foil portion for leads corresponding to the leads at both ends of each side of the IC is formed wider than the width of the conductive foil portion for leads corresponding to the other leads, and 1. A printed wiring board characterized in that a slit is provided in a conductive foil portion for a lead so as to form a portion inside thereof having a width substantially the same as that of another conductive foil portion for a lead and to which a lead is soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13155686U JPS6338367U (en) | 1986-08-28 | 1986-08-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13155686U JPS6338367U (en) | 1986-08-28 | 1986-08-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6338367U true JPS6338367U (en) | 1988-03-11 |
Family
ID=31030116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13155686U Pending JPS6338367U (en) | 1986-08-28 | 1986-08-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6338367U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04125647U (en) * | 1991-04-30 | 1992-11-16 | スズキ株式会社 | Internal combustion engine fuel supply control device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58132941A (en) * | 1982-02-02 | 1983-08-08 | Sharp Corp | Lead-connecting method for part-mounting substrate |
| JPS6223478B2 (en) * | 1978-10-13 | 1987-05-22 | Matsushita Electric Ind Co Ltd |
-
1986
- 1986-08-28 JP JP13155686U patent/JPS6338367U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6223478B2 (en) * | 1978-10-13 | 1987-05-22 | Matsushita Electric Ind Co Ltd | |
| JPS58132941A (en) * | 1982-02-02 | 1983-08-08 | Sharp Corp | Lead-connecting method for part-mounting substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04125647U (en) * | 1991-04-30 | 1992-11-16 | スズキ株式会社 | Internal combustion engine fuel supply control device |
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