JPS642471U - - Google Patents
Info
- Publication number
- JPS642471U JPS642471U JP9589587U JP9589587U JPS642471U JP S642471 U JPS642471 U JP S642471U JP 9589587 U JP9589587 U JP 9589587U JP 9589587 U JP9589587 U JP 9589587U JP S642471 U JPS642471 U JP S642471U
- Authority
- JP
- Japan
- Prior art keywords
- land
- wiring board
- printed wiring
- end side
- lands
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は、本考案が適用されたプリント配線基
板のＩＣ実装状態を示す斜視図、第２図は従来品
の実装構造を示す斜視図、第３図は従来品の半田
付け状態を示す側面図、第４図は半田付け後の従
来品を示す側面図、第５図は本実施例のランドを
示す平面図、第６図はレジスト膜形成後のランド
を示す平面図、第７図は半田付け後の側面図であ
る。１……ミニフラツトＩＣ、１ａ，１ｂ……リ
ード、２……プリント配線基板、３Ａ，３Ｂ……
大型ランド、３ａ，３ｂ……終端ランド、４ａ，
４ｂ……補助ランド、６……半田ブリツジ、８…
…レジスト膜。
Fig. 1 is a perspective view showing the IC mounting state of the printed wiring board to which the present invention is applied, Fig. 2 is a perspective view showing the mounting structure of the conventional product, and Fig. 3 is a side view showing the soldering state of the conventional product. 4 is a side view showing the conventional product after soldering, FIG. 5 is a plan view showing the land of this embodiment, FIG. 6 is a plan view showing the land after resist film formation, and FIG. 7 is a side view showing the conventional product after soldering. FIG. 3 is a side view after soldering. 1... Mini flat IC, 1a, 1b... Lead, 2... Printed wiring board, 3A, 3B...
Large land, 3a, 3b...Terminal land, 4a,
4b...Auxiliary land, 6...Solder bridge, 8...
...Resist film.
Claims (1)
ランドを有するプリント配線基板において、 端部側ランドを他のランドよりも面積的に大き
く形成し、 該端部側ランドの中間をレジスト膜で被覆して
終端ランドと補助ランドに二分したこと、 を特徴とするプリント配線基板。[Scope of Claim for Utility Model Registration] In a printed wiring board having lands to which leads of mini-flat ICs, etc. are soldered, the land on the end side is formed larger in area than the other lands, and the land on the end side is formed in the middle of the land on the end side. A printed wiring board characterized in that the printed wiring board is coated with a resist film and divided into a terminal land and an auxiliary land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9589587U JPS642471U (en) | 1987-06-24 | 1987-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9589587U JPS642471U (en) | 1987-06-24 | 1987-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS642471U true JPS642471U (en) | 1989-01-09 |
Family
ID=31320641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9589587U Pending JPS642471U (en) | 1987-06-24 | 1987-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS642471U (en) |
-
1987
- 1987-06-24 JP JP9589587U patent/JPS642471U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5936268U (en) | printed wiring board | |
| JPS62112179U (en) | ||
| JPS6310582U (en) | ||
| JPS642471U (en) | ||
| JPH0418474U (en) | ||
| JPS62196376U (en) | ||
| JPH0173967U (en) | ||
| JPS59195767U (en) | Pattern shape of printed wiring board | |
| JPH0217854U (en) | ||
| JPS63124772U (en) | ||
| JPS60167365U (en) | printed wiring board | |
| JPH0328775U (en) | ||
| JPS6338368U (en) | ||
| JPH0286175U (en) | ||
| JPS6422074U (en) | ||
| JPS642470U (en) | ||
| JPS60190063U (en) | square chip parts | |
| JPS62109479U (en) | ||
| JPS63149571U (en) | ||
| JPH0167725U (en) | ||
| JPS6336076U (en) | ||
| JPS61142474U (en) | ||
| JPS5878681U (en) | printed wiring circuit | |
| JPH042065U (en) | ||
| JPH0281026U (en) |