JPH0173967U - - Google Patents

Info

Publication number
JPH0173967U
JPH0173967U JP1987168664U JP16866487U JPH0173967U JP H0173967 U JPH0173967 U JP H0173967U JP 1987168664 U JP1987168664 U JP 1987168664U JP 16866487 U JP16866487 U JP 16866487U JP H0173967 U JPH0173967 U JP H0173967U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
land
lands
connectors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987168664U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987168664U priority Critical patent/JPH0173967U/ja
Publication of JPH0173967U publication Critical patent/JPH0173967U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図は本考案のプリント配線基板の
実施例を示すハンダ面のランド図。第３図は本考
案のランドの寸法図。第４図は本考案のランドの
表面張力について示す図。 １…プリント配線基板、２…ランド、３…ハン
ダブリツジ防止用ランド、４…スルーホール、５
…プリント配線基板流し方向、６…ハンダ。 1 and 2 are land diagrams of the solder surface showing an embodiment of the printed wiring board of the present invention. Figure 3 is a dimensional drawing of the land of the present invention. FIG. 4 is a diagram showing the surface tension of the land of the present invention. 1... Printed wiring board, 2... Land, 3... Land for preventing solder bridges, 4... Through hole, 5
...Printed wiring board flow direction, 6...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント配線基板のハンダ面において、ＩＣコ
ネクタ等のリードが並ぶ電子部品が挿入されるラ
ンドの最後のランドを、外側に大きくすることを
特徴とするプリント配線基板。 A printed wiring board characterized in that, on the solder side of the printed wiring board, the last land of the lands into which electronic components such as IC connectors are inserted is enlarged outward.
JP1987168664U 1987-11-04 1987-11-04 Pending JPH0173967U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987168664U JPH0173967U (en) 1987-11-04 1987-11-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987168664U JPH0173967U (en) 1987-11-04 1987-11-04

Publications (1)

Publication Number Publication Date
JPH0173967U true JPH0173967U (en) 1989-05-18

Family

ID=31458037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987168664U Pending JPH0173967U (en) 1987-11-04 1987-11-04

Country Status (1)

Country Link
JP (1) JPH0173967U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018020012A (en) * 2016-08-05 2018-02-08 株式会社三洋物産 Game machine
JP2018121674A (en) * 2017-01-30 2018-08-09 株式会社三洋物産 Game machine
JP2019177223A (en) * 2019-07-12 2019-10-17 株式会社三洋物産 Game machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018020012A (en) * 2016-08-05 2018-02-08 株式会社三洋物産 Game machine
JP2018121674A (en) * 2017-01-30 2018-08-09 株式会社三洋物産 Game machine
JP2021126587A (en) * 2017-01-30 2021-09-02 株式会社三洋物産 Game machine
JP2019177223A (en) * 2019-07-12 2019-10-17 株式会社三洋物産 Game machine

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